Liu, W., & Wu, D. (2020). Low Temperature Adhesive Bonding-Based Fabrication of an Air-Borne Flexible Piezoelectric Micromachined Ultrasonic Transducer. MDPI AG.
Čikaški stil citiranja (17. izdanje)Liu, Wei, i Dawei Wu. Low Temperature Adhesive Bonding-Based Fabrication of an Air-Borne Flexible Piezoelectric Micromachined Ultrasonic Transducer. MDPI AG, 2020.
MLA način citiranja (9. izdanje)Liu, Wei, i Dawei Wu. Low Temperature Adhesive Bonding-Based Fabrication of an Air-Borne Flexible Piezoelectric Micromachined Ultrasonic Transducer. MDPI AG, 2020.
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