Liu, W., & Wu, D. (2020). Low Temperature Adhesive Bonding-Based Fabrication of an Air-Borne Flexible Piezoelectric Micromachined Ultrasonic Transducer. MDPI AG.
芝加哥风格引文Liu, Wei, 与 Dawei Wu. Low Temperature Adhesive Bonding-Based Fabrication of an Air-Borne Flexible Piezoelectric Micromachined Ultrasonic Transducer. MDPI AG, 2020.
MLA引文Liu, Wei, 与 Dawei Wu. Low Temperature Adhesive Bonding-Based Fabrication of an Air-Borne Flexible Piezoelectric Micromachined Ultrasonic Transducer. MDPI AG, 2020.
警告：这些引文格式不一定是100％准确.