Low Temperature Adhesive Bonding-Based Fabrication of an Air-Borne Flexible Piezoelectric Micromachined Ultrasonic Transducer

Low Temperature Adhesive Bonding-Based Fabrication of an Air-Borne Flexible Piezoelectric Micromachined Ultrasonic Transducer

This paper presents the development of a flexible piezoelectric micromachined ultrasonic transducer (PMUT) that can conform to flat, concave, and convex surfaces and work in air. The PMUT consists of an Ag-coated polyvinylidene fluoride (PVDF) film mounted onto a laser-manipulated polymer substrate....

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Dettagli Bibliografici
Autori principali:	Wei Liu, Dawei Wu
Natura:	Articolo
Lingua:	English
Pubblicazione:	MDPI AG 2020-06-01
Serie:	Sensors
Soggetti:	flexible piezoelectric micromachined ultrasonic transducer (PMUT) air low temperature adhesive bonding time of flight (TOF)
Accesso online:	https://www.mdpi.com/1424-8220/20/11/3333

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