Evaluation of Adhesion Properties of Thin Film Structure through Surface Acoustic Wave Dispersion Simulation

Evaluation of Adhesion Properties of Thin Film Structure through Surface Acoustic Wave Dispersion Simulation

A theoretical simulation study of the dispersion characteristic of the surface acoustic wave (Rayleigh wave) was conducted by modeling the adhesion interlayer with stiffness coefficients to evaluate the bonding properties of nano-scale thin film structures. For experimental validation, a set of thin...

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Bibliographic Details
Main Authors:	Yu Min Choi, Dongchan Kang, Jeong Nyeon Kim, Ik Keun Park
Format:	Article
Language:	English
Published:	MDPI AG 2022-08-01
Series:	Materials
Subjects:	V(z) curve technique dispersion characteristics adhesion strength scanning acoustic microscope
Online Access:	https://www.mdpi.com/1996-1944/15/16/5637

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