Self-Limited ultraviolet laser sintering of liquid metal particles for μm-Thick flexible electronics devices

Lightweight, deformable and highly conductive conductors are rather appealing in flexible electronics devices such as electromagnetic interference (EMI) shielding films; however, the most commonly used metallic foils or carbon nanomaterials suffer from critical limitation of either film thickness or...

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Main Authors: Dong Ye, Zihan Peng, Jinxu Liu, YongAn Huang
Format: Article
Language:English
Published: Elsevier 2022-11-01
Series:Materials & Design
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S0264127522008115
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author Dong Ye
Zihan Peng
Jinxu Liu
YongAn Huang
author_facet Dong Ye
Zihan Peng
Jinxu Liu
YongAn Huang
author_sort Dong Ye
collection DOAJ
description Lightweight, deformable and highly conductive conductors are rather appealing in flexible electronics devices such as electromagnetic interference (EMI) shielding films; however, the most commonly used metallic foils or carbon nanomaterials suffer from critical limitation of either film thickness or electrical conductivity. Herein, we present a facile approach to rapidly fabricate sintered liquid metal submicron particles (LMSPs) films in combination spray-coating with direct nanosecond ultraviolet (UV) laser sintering. High conductive, μm-thick sintered LMSPs films were prepared owing to the self-limited penetration depth of UV laser, and their sheet resistances are easily tuned at least seven orders of magnitude by the laser processing parameters. A calculated parametric map upon particle diameter and laser fluence whether or not a liquid metal particle is ruptured has been obtained and it is quite well in accordance to the experiment results. Such laser-sintered LMSPs films are finally utilized to fabricate shielding films with superior EMI shielding effectiveness (SE) of ∼33 dB and specific EMI SE over thickness (SSE/t) of ∼27500 dB•cm2•g−1, and flexible electromagnetic metamaterials with a high absorption above 99.9 % at resonance frequency of 12.9 GHz and 14.3 GHz, showing their high potential for flexible EMI shielding and electromagnetic wave absorption applications.
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spelling doaj.art-ef08e8f052e84c49bd203c6b8c69fb022022-12-22T03:56:15ZengElsevierMaterials & Design0264-12752022-11-01223111189Self-Limited ultraviolet laser sintering of liquid metal particles for μm-Thick flexible electronics devicesDong Ye0Zihan Peng1Jinxu Liu2YongAn Huang3State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China; Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan 430074, China; Corresponding authors at: State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China.State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China; Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan 430074, ChinaState Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China; Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan 430074, ChinaState Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China; Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan 430074, China; Corresponding authors at: State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China.Lightweight, deformable and highly conductive conductors are rather appealing in flexible electronics devices such as electromagnetic interference (EMI) shielding films; however, the most commonly used metallic foils or carbon nanomaterials suffer from critical limitation of either film thickness or electrical conductivity. Herein, we present a facile approach to rapidly fabricate sintered liquid metal submicron particles (LMSPs) films in combination spray-coating with direct nanosecond ultraviolet (UV) laser sintering. High conductive, μm-thick sintered LMSPs films were prepared owing to the self-limited penetration depth of UV laser, and their sheet resistances are easily tuned at least seven orders of magnitude by the laser processing parameters. A calculated parametric map upon particle diameter and laser fluence whether or not a liquid metal particle is ruptured has been obtained and it is quite well in accordance to the experiment results. Such laser-sintered LMSPs films are finally utilized to fabricate shielding films with superior EMI shielding effectiveness (SE) of ∼33 dB and specific EMI SE over thickness (SSE/t) of ∼27500 dB•cm2•g−1, and flexible electromagnetic metamaterials with a high absorption above 99.9 % at resonance frequency of 12.9 GHz and 14.3 GHz, showing their high potential for flexible EMI shielding and electromagnetic wave absorption applications.http://www.sciencedirect.com/science/article/pii/S0264127522008115Liquid metal particlesUV laser sinteringLocalized surface plasmon resonanceElectromagnetic interference shieldingMetamaterials
spellingShingle Dong Ye
Zihan Peng
Jinxu Liu
YongAn Huang
Self-Limited ultraviolet laser sintering of liquid metal particles for μm-Thick flexible electronics devices
Materials & Design
Liquid metal particles
UV laser sintering
Localized surface plasmon resonance
Electromagnetic interference shielding
Metamaterials
title Self-Limited ultraviolet laser sintering of liquid metal particles for μm-Thick flexible electronics devices
title_full Self-Limited ultraviolet laser sintering of liquid metal particles for μm-Thick flexible electronics devices
title_fullStr Self-Limited ultraviolet laser sintering of liquid metal particles for μm-Thick flexible electronics devices
title_full_unstemmed Self-Limited ultraviolet laser sintering of liquid metal particles for μm-Thick flexible electronics devices
title_short Self-Limited ultraviolet laser sintering of liquid metal particles for μm-Thick flexible electronics devices
title_sort self limited ultraviolet laser sintering of liquid metal particles for μm thick flexible electronics devices
topic Liquid metal particles
UV laser sintering
Localized surface plasmon resonance
Electromagnetic interference shielding
Metamaterials
url http://www.sciencedirect.com/science/article/pii/S0264127522008115
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AT zihanpeng selflimitedultravioletlasersinteringofliquidmetalparticlesformmthickflexibleelectronicsdevices
AT jinxuliu selflimitedultravioletlasersinteringofliquidmetalparticlesformmthickflexibleelectronicsdevices
AT yonganhuang selflimitedultravioletlasersinteringofliquidmetalparticlesformmthickflexibleelectronicsdevices