Effect of Environmental Conditions and Additive Clay-Particles on Properties of Epoxy–Clay Nanocomposites: A Review

In the previous few decades, nanocomposites including epoxy risen-clay nanoparticles systems were proven possibility to have developed properties over original matrices. The environmental conditions, which surround the nanocomposite systems, have a scientific effect on their properties during using...

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Bibliographic Details
Main Author: Qayes Abbas
Format: Article
Language:English
Published: University of Anbar 2023-06-01
Series:مجلة جامعة الانبار للعلوم الصرفة
Subjects:
Online Access:https://juaps.uoanbar.edu.iq/article_178872_6260df1e255742376e39d23f54dc36f9.pdf
Description
Summary:In the previous few decades, nanocomposites including epoxy risen-clay nanoparticles systems were proven possibility to have developed properties over original matrices. The environmental conditions, which surround the nanocomposite systems, have a scientific effect on their properties during using them for a long time. Therefore, studying the effect of environmental conditions associated with adding clay nanoparticles on the properties of nanocomposites is important to achieve the requirement of the applications. Nanocomposites are utilized in substructure applications and experience mechanical loads and thermal effects when they are exposed to environmental surrounding conditions which are included electromagnetic ultraviolet (UV) energy, humidity or wetness, water absorbance, and some alkaline solutions. These materials are showed their ability to barrier the environmental surrounding effects. Diffuse the liquids in nanocomposite systems has been established by different approaches (models). The review study involves the research effort performed on nanocomposite (epoxy-clay nanoparticles) under some environmental issues such as moisture or water properties and their diffusion into nanocomposite, exposure to various environments: radiation in the range of UV, temperature, and humidity. The current developments are additionally discussed.
ISSN:1991-8941
2706-6703