Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints
Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF), have drawn attention related to their use in electronic packaging. The Sn grain orientation is recognized as playi...
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-07-01
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| Series: | Materials |
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| Online Access: | https://www.mdpi.com/1996-1944/15/14/5086 |
| _version_ | 1797417262953529344 |
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| author | Yu-An Shen John A. Wu |
| author_facet | Yu-An Shen John A. Wu |
| author_sort | Yu-An Shen |
| collection | DOAJ |
| description | Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF), have drawn attention related to their use in electronic packaging. The Sn grain orientation is recognized as playing an important role in reliability issues due to its anisotropic diffusivity, mechanical properties, and coefficient of thermal expansion. This study reviews the effects of the Sn grain orientation on the EM, TM, and TMF in Sn-rich solder joints. The findings indicate that in spite of the failure modes dominated by the Sn grain orientation, the size and shape of the solder joint, as well as the Sn microstructures, such as the cycling twining boundary (CTB), single crystals, and misorientations of the Sn grain boundary, should be considered in more detail. In addition, we show that two methods, involving a strong magnetic field and seed crystal layers, can control the Sn grain orientations during the solidification of Sn-rich solder joints. |
| first_indexed | 2024-03-09T06:16:10Z |
| format | Article |
| id | doaj.art-f0225fe7f9784ba7840720123ba15d6a |
| institution | Directory Open Access Journal |
| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-09T06:16:10Z |
| publishDate | 2022-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Materials |
| spelling | doaj.art-f0225fe7f9784ba7840720123ba15d6a2023-12-03T11:53:12ZengMDPI AGMaterials1996-19442022-07-011514508610.3390/ma15145086Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder JointsYu-An Shen0John A. Wu1Department of Materials Science and Engineering, Feng Chia University, Taichung 407, TaiwanSchool of Materials Engineering, Purdue University, West Lafayette, IN 47907, USASn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF), have drawn attention related to their use in electronic packaging. The Sn grain orientation is recognized as playing an important role in reliability issues due to its anisotropic diffusivity, mechanical properties, and coefficient of thermal expansion. This study reviews the effects of the Sn grain orientation on the EM, TM, and TMF in Sn-rich solder joints. The findings indicate that in spite of the failure modes dominated by the Sn grain orientation, the size and shape of the solder joint, as well as the Sn microstructures, such as the cycling twining boundary (CTB), single crystals, and misorientations of the Sn grain boundary, should be considered in more detail. In addition, we show that two methods, involving a strong magnetic field and seed crystal layers, can control the Sn grain orientations during the solidification of Sn-rich solder joints.https://www.mdpi.com/1996-1944/15/14/5086lead-free solderSn grain orientationelectromigrationthermomigrationthermomechanical fatigueSn orientation control |
| spellingShingle | Yu-An Shen John A. Wu Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints Materials lead-free solder Sn grain orientation electromigration thermomigration thermomechanical fatigue Sn orientation control |
| title | Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints |
| title_full | Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints |
| title_fullStr | Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints |
| title_full_unstemmed | Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints |
| title_short | Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints |
| title_sort | effect of sn grain orientation on reliability issues of sn rich solder joints |
| topic | lead-free solder Sn grain orientation electromigration thermomigration thermomechanical fatigue Sn orientation control |
| url | https://www.mdpi.com/1996-1944/15/14/5086 |
| work_keys_str_mv | AT yuanshen effectofsngrainorientationonreliabilityissuesofsnrichsolderjoints AT johnawu effectofsngrainorientationonreliabilityissuesofsnrichsolderjoints |