Enhanced Thermal Conductivity of Epoxy Composites Filled with Al<sub>2</sub>O<sub>3</sub>/Boron Nitride Hybrids for Underfill Encapsulation Materials

Enhanced Thermal Conductivity of Epoxy Composites Filled with Al<sub>2</sub>O<sub>3</sub>/Boron Nitride Hybrids for Underfill Encapsulation Materials

In this study, a thermal conductivity of 0.22 W·m<sup>−1</sup>·K<sup>−1</sup> was obtained for pristine epoxy (EP), and the impact of a hybrid filler composed of two-dimensional (2D) flake-like boron nitride (BN) and zero-dimensional (0D) spherical micro-sized aluminum oxide...

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Bibliographic Details
Main Authors:	William Anderson Lee Sanchez, Chen-Yang Huang, Jian-Xun Chen, Yu-Chian Soong, Ying-Nan Chan, Kuo-Chan Chiou, Tzong-Ming Lee, Chih-Chia Cheng, Chih-Wei Chiu
Format:	Article
Language:	English
Published:	MDPI AG 2021-01-01
Series:	Polymers
Subjects:	underfill encapsulation aluminum oxide boron nitride hybrid filler thermal conductivity coefficient of thermal expansion
Online Access:	https://www.mdpi.com/2073-4360/13/1/147

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