Controlling sintering and grain growth of nanoceramics

Abstract Sintering and grain growth are fundamental processes affecting microstructural evolution of ceramics. The phenomenological models describing these processes as found in textbooks are simplifications of the very dynamic set of system’s parameters, which lead to limited predictability and the...

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Bibliographic Details
Main Author: R. H. R. Castro
Format: Article
Language:English
Published: Associação Brasileira de Cerâmica
Series:Cerâmica
Subjects:
Online Access:http://www.scielo.br/scielo.php?script=sci_arttext&pid=S0366-69132019000100122&lng=en&tlng=en
Description
Summary:Abstract Sintering and grain growth are fundamental processes affecting microstructural evolution of ceramics. The phenomenological models describing these processes as found in textbooks are simplifications of the very dynamic set of system’s parameters, which lead to limited predictability and the need for extensive empirical analyses for process optimization. One such simplification is the underestimation of interfacial energies and their relationships with diffusion paths and growth control. The goal of this paper is to clarify how thermodynamics of interfaces can provide opportunities for a more refined control of ceramic processing. On the first part of this paper we discuss the relevance of grain boundary energies in grain growth, showing that although grain boundary mobility is the preferred parameter choice for designing of grain growth inhibition, recent studies demonstrate dopants can be selected to annihilate the process driving force and enable thermally (meta)stable nanoceramics. In the second part of the paper, we point out shortcomings from the current sintering theory and discuss that both surface and grain boundary energies with their associated rates of interfacial area evolution represent a more comprehensive sintering description. This perspective offers tunable parameters that may set a new foundation for the design of sintering aids for optimal densification.
ISSN:1678-4553