Experimental and Numerical Development on Multi-Material Joining Technology for Sandwich-Structured Composite Materials

Creating connection points for sandwich-structured composites without losing technical performance is key to realising optimal lightweight structures. The patented LiteWWeight<sup>®</sup> technology presents cost-effective connections on sandwich panels in a fraction of a few seconds wit...

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Main Authors: Lucian Zweifel, Igor Zhilyaev, Christian Brauner, Martin Rheme, Gregor Eckhard, Valentin Bersier, Slobodan Glavaški, Ricardo Pfeiffer
Format: Article
Language:English
Published: MDPI AG 2021-10-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/14/20/6005
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author Lucian Zweifel
Igor Zhilyaev
Christian Brauner
Martin Rheme
Gregor Eckhard
Valentin Bersier
Slobodan Glavaški
Ricardo Pfeiffer
author_facet Lucian Zweifel
Igor Zhilyaev
Christian Brauner
Martin Rheme
Gregor Eckhard
Valentin Bersier
Slobodan Glavaški
Ricardo Pfeiffer
author_sort Lucian Zweifel
collection DOAJ
description Creating connection points for sandwich-structured composites without losing technical performance is key to realising optimal lightweight structures. The patented LiteWWeight<sup>®</sup> technology presents cost-effective connections on sandwich panels in a fraction of a few seconds without predrilling. Ultrasonic equipment is used to insert a thermoplastic fastener into the substrate material and partially melt it into the porous internal structure. This creates a highly interlocked connection (connection strength is above 500 N) suitable for semi-structural applications. This study focused on the simulation and experimental validation of this process, mainly on the interaction between the pin and the substrate material during the joining process. The dynamic thermo-mechanical model showed reasonable agreement with experimental methods such as process data, high-speed camera monitoring or computed tomography and allowed the prediction of the connection quality by evaluation of the degree of interlock. The connection strength prediction by the developed model was validated within several various process setups, resulting in a prediction accuracy between 94–99% depending on the setup.
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spelling doaj.art-f0da82c8c1ca477c83807bc7d22b02522023-11-22T18:57:25ZengMDPI AGMaterials1996-19442021-10-011420600510.3390/ma14206005Experimental and Numerical Development on Multi-Material Joining Technology for Sandwich-Structured Composite MaterialsLucian Zweifel0Igor Zhilyaev1Christian Brauner2Martin Rheme3Gregor Eckhard4Valentin Bersier5Slobodan Glavaški6Ricardo Pfeiffer7Institute of Polymer Engineering, FHNW University of Applied Sciences and Arts Northwestern Switzerland, Klosterzelgstrasse 2, 5210 Windisch, SwitzerlandInstitute of Polymer Engineering, FHNW University of Applied Sciences and Arts Northwestern Switzerland, Klosterzelgstrasse 2, 5210 Windisch, SwitzerlandInstitute of Polymer Engineering, FHNW University of Applied Sciences and Arts Northwestern Switzerland, Klosterzelgstrasse 2, 5210 Windisch, SwitzerlandMultiMaterial-Welding AG, Zentralstrasse 115, 2503 Biel, SwitzerlandMultiMaterial-Welding AG, Zentralstrasse 115, 2503 Biel, SwitzerlandMultiMaterial-Welding AG, Zentralstrasse 115, 2503 Biel, SwitzerlandMultiMaterial-Welding AG, Zentralstrasse 115, 2503 Biel, SwitzerlandKVT-Fastening AG (Bossard Group), Lagerstrasse 8, 8953 Dietikon, SwitzerlandCreating connection points for sandwich-structured composites without losing technical performance is key to realising optimal lightweight structures. The patented LiteWWeight<sup>®</sup> technology presents cost-effective connections on sandwich panels in a fraction of a few seconds without predrilling. Ultrasonic equipment is used to insert a thermoplastic fastener into the substrate material and partially melt it into the porous internal structure. This creates a highly interlocked connection (connection strength is above 500 N) suitable for semi-structural applications. This study focused on the simulation and experimental validation of this process, mainly on the interaction between the pin and the substrate material during the joining process. The dynamic thermo-mechanical model showed reasonable agreement with experimental methods such as process data, high-speed camera monitoring or computed tomography and allowed the prediction of the connection quality by evaluation of the degree of interlock. The connection strength prediction by the developed model was validated within several various process setups, resulting in a prediction accuracy between 94–99% depending on the setup.https://www.mdpi.com/1996-1944/14/20/6005joiningprocess modelling and simulationsandwich structuresnumerical analysisultrasonic technologypolymer composites
spellingShingle Lucian Zweifel
Igor Zhilyaev
Christian Brauner
Martin Rheme
Gregor Eckhard
Valentin Bersier
Slobodan Glavaški
Ricardo Pfeiffer
Experimental and Numerical Development on Multi-Material Joining Technology for Sandwich-Structured Composite Materials
Materials
joining
process modelling and simulation
sandwich structures
numerical analysis
ultrasonic technology
polymer composites
title Experimental and Numerical Development on Multi-Material Joining Technology for Sandwich-Structured Composite Materials
title_full Experimental and Numerical Development on Multi-Material Joining Technology for Sandwich-Structured Composite Materials
title_fullStr Experimental and Numerical Development on Multi-Material Joining Technology for Sandwich-Structured Composite Materials
title_full_unstemmed Experimental and Numerical Development on Multi-Material Joining Technology for Sandwich-Structured Composite Materials
title_short Experimental and Numerical Development on Multi-Material Joining Technology for Sandwich-Structured Composite Materials
title_sort experimental and numerical development on multi material joining technology for sandwich structured composite materials
topic joining
process modelling and simulation
sandwich structures
numerical analysis
ultrasonic technology
polymer composites
url https://www.mdpi.com/1996-1944/14/20/6005
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