Effects Of Nickel On The Microstructure And The Mechanical Properties Of Sn-0.7Cu Lead-Free Solders
This paper investigates the effects of small amount nickel addition (0, 200, 400, 800, 1800 ppm) on the microstructure and the mechanical properties of Sn-0.7Cu lead-free solder alloys. It is known that even ppm level Ni additions have significant effects on the microstructure of Sn-Cu solder alloys...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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Polish Academy of Sciences
2015-06-01
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| Series: | Archives of Metallurgy and Materials |
| Subjects: | |
| Online Access: | http://www.degruyter.com/view/j/amm.2015.60.issue-2/amm-2015-0151/amm-2015-0151.xml?format=INT |
| _version_ | 1818504884420345856 |
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| author | Gyenes A. Simon A. Lanszki P. Gácsi Z. |
| author_facet | Gyenes A. Simon A. Lanszki P. Gácsi Z. |
| author_sort | Gyenes A. |
| collection | DOAJ |
| description | This paper investigates the effects of small amount nickel addition (0, 200, 400, 800, 1800 ppm) on the microstructure and the mechanical properties of Sn-0.7Cu lead-free solder alloys. It is known that even ppm level Ni additions have significant effects on the microstructure of Sn-Cu solder alloys. Ni suppresses the growth of β-Sn dendrites in favour of eutectic formation. As the nickel content increases, the microstructure undergoes a morphological evolution from hypoeutectic through fully eutectic to hypereutectic. Along with these transformations, the mechanical properties of the alloy also significantly change. Based on the experimental results presented in this paper, the Sn-0.7Cu solder achieves maximum strength at the addition level of 800 ppm Ni, when the microstructure becomes fully eutectic. |
| first_indexed | 2024-12-10T21:43:16Z |
| format | Article |
| id | doaj.art-f13e5ceca9f345e6a98c888194e88bcf |
| institution | Directory Open Access Journal |
| issn | 2300-1909 |
| language | English |
| last_indexed | 2024-12-10T21:43:16Z |
| publishDate | 2015-06-01 |
| publisher | Polish Academy of Sciences |
| record_format | Article |
| series | Archives of Metallurgy and Materials |
| spelling | doaj.art-f13e5ceca9f345e6a98c888194e88bcf2022-12-22T01:32:27ZengPolish Academy of SciencesArchives of Metallurgy and Materials2300-19092015-06-016021449145410.1515/amm-2015-0151amm-2015-0151Effects Of Nickel On The Microstructure And The Mechanical Properties Of Sn-0.7Cu Lead-Free SoldersGyenes A.0Simon A.1Lanszki P.2Gácsi Z.3 INSTITUTE OF PHYSICAL METALLURGY, METAL FORMING AND NANOTECHNOLOGY, UNIVERSITY OF MISKOLC, H-3515 MISKOLC-EGYETEMVÁROS, HUNGARY INSTITUTE OF CERAMICS AND POLYMER ENGINEERING, UNIVERSITY OF MISKOLC, H-3515 MISKOLC-EGYETEMVÁROS, HUNGARY INSTITUTE OF PHYSICAL METALLURGY, METAL FORMING AND NANOTECHNOLOGY, UNIVERSITY OF MISKOLC, H-3515 MISKOLC-EGYETEMVÁROS, HUNGARY INSTITUTE OF PHYSICAL METALLURGY, METAL FORMING AND NANOTECHNOLOGY, UNIVERSITY OF MISKOLC, H-3515 MISKOLC-EGYETEMVÁROS, HUNGARYThis paper investigates the effects of small amount nickel addition (0, 200, 400, 800, 1800 ppm) on the microstructure and the mechanical properties of Sn-0.7Cu lead-free solder alloys. It is known that even ppm level Ni additions have significant effects on the microstructure of Sn-Cu solder alloys. Ni suppresses the growth of β-Sn dendrites in favour of eutectic formation. As the nickel content increases, the microstructure undergoes a morphological evolution from hypoeutectic through fully eutectic to hypereutectic. Along with these transformations, the mechanical properties of the alloy also significantly change. Based on the experimental results presented in this paper, the Sn-0.7Cu solder achieves maximum strength at the addition level of 800 ppm Ni, when the microstructure becomes fully eutectic.http://www.degruyter.com/view/j/amm.2015.60.issue-2/amm-2015-0151/amm-2015-0151.xml?format=INTSn-0.7Culead-free solderNi additionmicrostructuremechanical properties |
| spellingShingle | Gyenes A. Simon A. Lanszki P. Gácsi Z. Effects Of Nickel On The Microstructure And The Mechanical Properties Of Sn-0.7Cu Lead-Free Solders Archives of Metallurgy and Materials Sn-0.7Cu lead-free solder Ni addition microstructure mechanical properties |
| title | Effects Of Nickel On The Microstructure And The Mechanical Properties Of Sn-0.7Cu Lead-Free Solders |
| title_full | Effects Of Nickel On The Microstructure And The Mechanical Properties Of Sn-0.7Cu Lead-Free Solders |
| title_fullStr | Effects Of Nickel On The Microstructure And The Mechanical Properties Of Sn-0.7Cu Lead-Free Solders |
| title_full_unstemmed | Effects Of Nickel On The Microstructure And The Mechanical Properties Of Sn-0.7Cu Lead-Free Solders |
| title_short | Effects Of Nickel On The Microstructure And The Mechanical Properties Of Sn-0.7Cu Lead-Free Solders |
| title_sort | effects of nickel on the microstructure and the mechanical properties of sn 0 7cu lead free solders |
| topic | Sn-0.7Cu lead-free solder Ni addition microstructure mechanical properties |
| url | http://www.degruyter.com/view/j/amm.2015.60.issue-2/amm-2015-0151/amm-2015-0151.xml?format=INT |
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