Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions
With the rapid development of the microelectronics industry, many efforts have been made to improve glass-ceramics’ sinterability, thermal conductivity, and dielectric properties, which are essential components of electronic materials. In this study, low-alkali borosilicate glass-ceramics with PVA a...
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MDPI AG
2022-02-01
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Online Access: | https://www.mdpi.com/1996-1944/15/5/1685 |
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author | Dilara Arıbuğa Ufuk Akkaşoğlu Buğra Çiçek Özge Balcı-Çağıran |
author_facet | Dilara Arıbuğa Ufuk Akkaşoğlu Buğra Çiçek Özge Balcı-Çağıran |
author_sort | Dilara Arıbuğa |
collection | DOAJ |
description | With the rapid development of the microelectronics industry, many efforts have been made to improve glass-ceramics’ sinterability, thermal conductivity, and dielectric properties, which are essential components of electronic materials. In this study, low-alkali borosilicate glass-ceramics with PVA addition and glass-BN composites were prepared and successfully sintered at 770 °C. The phase composition, density, microstructure, thermal conductivity, and dielectric constant were investigated. It was shown that PVA addition contributes to the densification process of glass-ceramics (~88% relative density, with closed/open pores in the microstructure) and improves the thermal conductivity of glass material from 1.489 to 2.453 W/K.m. On the other hand, increasing BN addition improves microstructures by decreasing porosities and thus increasing relative densities. A glass-12 wt. % BN composite sample exhibited almost full densification after sintering and presented apparent and open pores of 2.6 and 0.08%, respectively. A high thermal conductivity value of 3.955 W/K.m and a low dielectric constant of 3.00 (at 5 MHz) were observed in this material. Overall, the resulting glass-ceramic samples showed dielectric constants in the range of 2.40–4.43, providing a potential candidate for various electronic applications. |
first_indexed | 2024-03-09T20:33:33Z |
format | Article |
id | doaj.art-f1819a1ec55e49409b518be9446361fa |
institution | Directory Open Access Journal |
issn | 1996-1944 |
language | English |
last_indexed | 2024-03-09T20:33:33Z |
publishDate | 2022-02-01 |
publisher | MDPI AG |
record_format | Article |
series | Materials |
spelling | doaj.art-f1819a1ec55e49409b518be9446361fa2023-11-23T23:17:15ZengMDPI AGMaterials1996-19442022-02-01155168510.3390/ma15051685Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN AdditionsDilara Arıbuğa0Ufuk Akkaşoğlu1Buğra Çiçek2Özge Balcı-Çağıran3Graduate School of Sciences and Engineering, Koç University, 34450 Istanbul, TurkeyAkcoat R&D Center, Ceramic Coatings Division, 2nd Industrial Zone, 54300 Sakarya, TurkeyDepartment of Metallurgical and Materials Engineering, Yıldız Technical University, 34210 Istanbul, TurkeyKoç University Boron and Advanced Materials Application and Research Center, Koç University, 34450 Istanbul, TurkeyWith the rapid development of the microelectronics industry, many efforts have been made to improve glass-ceramics’ sinterability, thermal conductivity, and dielectric properties, which are essential components of electronic materials. In this study, low-alkali borosilicate glass-ceramics with PVA addition and glass-BN composites were prepared and successfully sintered at 770 °C. The phase composition, density, microstructure, thermal conductivity, and dielectric constant were investigated. It was shown that PVA addition contributes to the densification process of glass-ceramics (~88% relative density, with closed/open pores in the microstructure) and improves the thermal conductivity of glass material from 1.489 to 2.453 W/K.m. On the other hand, increasing BN addition improves microstructures by decreasing porosities and thus increasing relative densities. A glass-12 wt. % BN composite sample exhibited almost full densification after sintering and presented apparent and open pores of 2.6 and 0.08%, respectively. A high thermal conductivity value of 3.955 W/K.m and a low dielectric constant of 3.00 (at 5 MHz) were observed in this material. Overall, the resulting glass-ceramic samples showed dielectric constants in the range of 2.40–4.43, providing a potential candidate for various electronic applications.https://www.mdpi.com/1996-1944/15/5/1685glass-BN compositesPVA additionlow temperature sinteringmicrostructurethermal conductivitydielectric constant |
spellingShingle | Dilara Arıbuğa Ufuk Akkaşoğlu Buğra Çiçek Özge Balcı-Çağıran Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions Materials glass-BN composites PVA addition low temperature sintering microstructure thermal conductivity dielectric constant |
title | Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions |
title_full | Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions |
title_fullStr | Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions |
title_full_unstemmed | Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions |
title_short | Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions |
title_sort | enhanced sinterability thermal conductivity and dielectric constant of glass ceramics with pva and bn additions |
topic | glass-BN composites PVA addition low temperature sintering microstructure thermal conductivity dielectric constant |
url | https://www.mdpi.com/1996-1944/15/5/1685 |
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