Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions

With the rapid development of the microelectronics industry, many efforts have been made to improve glass-ceramics’ sinterability, thermal conductivity, and dielectric properties, which are essential components of electronic materials. In this study, low-alkali borosilicate glass-ceramics with PVA a...

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Main Authors: Dilara Arıbuğa, Ufuk Akkaşoğlu, Buğra Çiçek, Özge Balcı-Çağıran
Format: Article
Language:English
Published: MDPI AG 2022-02-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/15/5/1685
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author Dilara Arıbuğa
Ufuk Akkaşoğlu
Buğra Çiçek
Özge Balcı-Çağıran
author_facet Dilara Arıbuğa
Ufuk Akkaşoğlu
Buğra Çiçek
Özge Balcı-Çağıran
author_sort Dilara Arıbuğa
collection DOAJ
description With the rapid development of the microelectronics industry, many efforts have been made to improve glass-ceramics’ sinterability, thermal conductivity, and dielectric properties, which are essential components of electronic materials. In this study, low-alkali borosilicate glass-ceramics with PVA addition and glass-BN composites were prepared and successfully sintered at 770 °C. The phase composition, density, microstructure, thermal conductivity, and dielectric constant were investigated. It was shown that PVA addition contributes to the densification process of glass-ceramics (~88% relative density, with closed/open pores in the microstructure) and improves the thermal conductivity of glass material from 1.489 to 2.453 W/K.m. On the other hand, increasing BN addition improves microstructures by decreasing porosities and thus increasing relative densities. A glass-12 wt. % BN composite sample exhibited almost full densification after sintering and presented apparent and open pores of 2.6 and 0.08%, respectively. A high thermal conductivity value of 3.955 W/K.m and a low dielectric constant of 3.00 (at 5 MHz) were observed in this material. Overall, the resulting glass-ceramic samples showed dielectric constants in the range of 2.40–4.43, providing a potential candidate for various electronic applications.
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spelling doaj.art-f1819a1ec55e49409b518be9446361fa2023-11-23T23:17:15ZengMDPI AGMaterials1996-19442022-02-01155168510.3390/ma15051685Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN AdditionsDilara Arıbuğa0Ufuk Akkaşoğlu1Buğra Çiçek2Özge Balcı-Çağıran3Graduate School of Sciences and Engineering, Koç University, 34450 Istanbul, TurkeyAkcoat R&D Center, Ceramic Coatings Division, 2nd Industrial Zone, 54300 Sakarya, TurkeyDepartment of Metallurgical and Materials Engineering, Yıldız Technical University, 34210 Istanbul, TurkeyKoç University Boron and Advanced Materials Application and Research Center, Koç University, 34450 Istanbul, TurkeyWith the rapid development of the microelectronics industry, many efforts have been made to improve glass-ceramics’ sinterability, thermal conductivity, and dielectric properties, which are essential components of electronic materials. In this study, low-alkali borosilicate glass-ceramics with PVA addition and glass-BN composites were prepared and successfully sintered at 770 °C. The phase composition, density, microstructure, thermal conductivity, and dielectric constant were investigated. It was shown that PVA addition contributes to the densification process of glass-ceramics (~88% relative density, with closed/open pores in the microstructure) and improves the thermal conductivity of glass material from 1.489 to 2.453 W/K.m. On the other hand, increasing BN addition improves microstructures by decreasing porosities and thus increasing relative densities. A glass-12 wt. % BN composite sample exhibited almost full densification after sintering and presented apparent and open pores of 2.6 and 0.08%, respectively. A high thermal conductivity value of 3.955 W/K.m and a low dielectric constant of 3.00 (at 5 MHz) were observed in this material. Overall, the resulting glass-ceramic samples showed dielectric constants in the range of 2.40–4.43, providing a potential candidate for various electronic applications.https://www.mdpi.com/1996-1944/15/5/1685glass-BN compositesPVA additionlow temperature sinteringmicrostructurethermal conductivitydielectric constant
spellingShingle Dilara Arıbuğa
Ufuk Akkaşoğlu
Buğra Çiçek
Özge Balcı-Çağıran
Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions
Materials
glass-BN composites
PVA addition
low temperature sintering
microstructure
thermal conductivity
dielectric constant
title Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions
title_full Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions
title_fullStr Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions
title_full_unstemmed Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions
title_short Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions
title_sort enhanced sinterability thermal conductivity and dielectric constant of glass ceramics with pva and bn additions
topic glass-BN composites
PVA addition
low temperature sintering
microstructure
thermal conductivity
dielectric constant
url https://www.mdpi.com/1996-1944/15/5/1685
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AT bugracicek enhancedsinterabilitythermalconductivityanddielectricconstantofglassceramicswithpvaandbnadditions
AT ozgebalcıcagıran enhancedsinterabilitythermalconductivityanddielectricconstantofglassceramicswithpvaandbnadditions