Additive concentration and nozzle moving speed influence on local copper deposition for electrochemical 3D-printing
The local deposition process from copper sulfate electrolyte was investigated depending on nozzle moving speed and additive concentration in the electrolyte. A 2×2 cm square model was created and sliced in Ultimaker Cura software, uploaded in a 3D printer, and printed from the copper electrolyte on...
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
International Association of Physical Chemists (IAPC)
2024-03-01
|
| Series: | Journal of Electrochemical Science and Engineering |
| Subjects: | |
| Online Access: | https://pub.iapchem.org/ojs/index.php/JESE/article/view/2291 |
| _version_ | 1797219360879673344 |
|---|---|
| author | Roman Babchuk Dmytro Uschapovskiy Viktoria Vorobyova Olga Linyucheva Mykhailo Kotyk Georgii Vasyliev |
| author_facet | Roman Babchuk Dmytro Uschapovskiy Viktoria Vorobyova Olga Linyucheva Mykhailo Kotyk Georgii Vasyliev |
| author_sort | Roman Babchuk |
| collection | DOAJ |
| description |
The local deposition process from copper sulfate electrolyte was investigated depending on nozzle moving speed and additive concentration in the electrolyte. A 2×2 cm square model was created and sliced in Ultimaker Cura software, uploaded in a 3D printer, and printed from the copper electrolyte on the stainless-steel surface. Low additive concentration in the electrolyte was found to influence dendrite formation in the corner sections of a square model. Nozzle movement speed was found to influence the deposition area and the thickness of the metal. The lowest tested nozzle movement speed of 5 s / voxel increased the deposition area by nearly 40 % in horizontal direction compared to 2.5 s / voxel. Further increase of nozzle movement speed to 1.6 s / voxel does not change the deposition area. The thickness in the corners increases by 2.5 times compared to the straight section of the square when the nozzle movement speed increases from 5 to 1.6 s / voxel. The non-uniform thickness of the deposited metal is caused by a considerable reduction of nozzle movement speed when it moves through the corner. The results obtained in this work can be further used to develop electrochemical 3D printing technology.
|
| first_indexed | 2024-04-24T12:32:25Z |
| format | Article |
| id | doaj.art-f1d465c2f986424797dfbaaa5b14463d |
| institution | Directory Open Access Journal |
| issn | 1847-9286 |
| language | English |
| last_indexed | 2024-04-24T12:32:25Z |
| publishDate | 2024-03-01 |
| publisher | International Association of Physical Chemists (IAPC) |
| record_format | Article |
| series | Journal of Electrochemical Science and Engineering |
| spelling | doaj.art-f1d465c2f986424797dfbaaa5b14463d2024-04-08T02:48:23ZengInternational Association of Physical Chemists (IAPC)Journal of Electrochemical Science and Engineering1847-92862024-03-0110.5599/jese.2291Additive concentration and nozzle moving speed influence on local copper deposition for electrochemical 3D-printingRoman Babchuk0Dmytro Uschapovskiy1Viktoria Vorobyova2Olga Linyucheva3Mykhailo Kotyk4Georgii Vasyliev5National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, 37, Prospect Beresteiskyi, Kyiv-56, 03056, Ukraine National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, 37, Prospect Beresteiskyi, Kyiv-56, 03056, Ukraine National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, 37, Prospect Beresteiskyi, Kyiv-56, 03056, Ukraine National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, 37, Prospect Beresteiskyi, Kyiv-56, 03056, Ukraine National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, 37, Prospect Beresteiskyi, Kyiv-56, 03056, Ukraine National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”, 37, Prospect Beresteiskyi, Kyiv-56, 03056, Ukraine The local deposition process from copper sulfate electrolyte was investigated depending on nozzle moving speed and additive concentration in the electrolyte. A 2×2 cm square model was created and sliced in Ultimaker Cura software, uploaded in a 3D printer, and printed from the copper electrolyte on the stainless-steel surface. Low additive concentration in the electrolyte was found to influence dendrite formation in the corner sections of a square model. Nozzle movement speed was found to influence the deposition area and the thickness of the metal. The lowest tested nozzle movement speed of 5 s / voxel increased the deposition area by nearly 40 % in horizontal direction compared to 2.5 s / voxel. Further increase of nozzle movement speed to 1.6 s / voxel does not change the deposition area. The thickness in the corners increases by 2.5 times compared to the straight section of the square when the nozzle movement speed increases from 5 to 1.6 s / voxel. The non-uniform thickness of the deposited metal is caused by a considerable reduction of nozzle movement speed when it moves through the corner. The results obtained in this work can be further used to develop electrochemical 3D printing technology. https://pub.iapchem.org/ojs/index.php/JESE/article/view/2291Additive manufacturingcopper electroplatingslicingprofilometry |
| spellingShingle | Roman Babchuk Dmytro Uschapovskiy Viktoria Vorobyova Olga Linyucheva Mykhailo Kotyk Georgii Vasyliev Additive concentration and nozzle moving speed influence on local copper deposition for electrochemical 3D-printing Journal of Electrochemical Science and Engineering Additive manufacturing copper electroplating slicing profilometry |
| title | Additive concentration and nozzle moving speed influence on local copper deposition for electrochemical 3D-printing |
| title_full | Additive concentration and nozzle moving speed influence on local copper deposition for electrochemical 3D-printing |
| title_fullStr | Additive concentration and nozzle moving speed influence on local copper deposition for electrochemical 3D-printing |
| title_full_unstemmed | Additive concentration and nozzle moving speed influence on local copper deposition for electrochemical 3D-printing |
| title_short | Additive concentration and nozzle moving speed influence on local copper deposition for electrochemical 3D-printing |
| title_sort | additive concentration and nozzle moving speed influence on local copper deposition for electrochemical 3d printing |
| topic | Additive manufacturing copper electroplating slicing profilometry |
| url | https://pub.iapchem.org/ojs/index.php/JESE/article/view/2291 |
| work_keys_str_mv | AT romanbabchuk additiveconcentrationandnozzlemovingspeedinfluenceonlocalcopperdepositionforelectrochemical3dprinting AT dmytrouschapovskiy additiveconcentrationandnozzlemovingspeedinfluenceonlocalcopperdepositionforelectrochemical3dprinting AT viktoriavorobyova additiveconcentrationandnozzlemovingspeedinfluenceonlocalcopperdepositionforelectrochemical3dprinting AT olgalinyucheva additiveconcentrationandnozzlemovingspeedinfluenceonlocalcopperdepositionforelectrochemical3dprinting AT mykhailokotyk additiveconcentrationandnozzlemovingspeedinfluenceonlocalcopperdepositionforelectrochemical3dprinting AT georgiivasyliev additiveconcentrationandnozzlemovingspeedinfluenceonlocalcopperdepositionforelectrochemical3dprinting |