Additive concentration and nozzle moving speed influence on local copper deposition for electrochemical 3D-printing
The local deposition process from copper sulfate electrolyte was investigated depending on nozzle moving speed and additive concentration in the electrolyte. A 2×2 cm square model was created and sliced in Ultimaker Cura software, uploaded in a 3D printer, and printed from the copper electrolyte on...
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
International Association of Physical Chemists (IAPC)
2024-03-01
|
| Series: | Journal of Electrochemical Science and Engineering |
| Subjects: | |
| Online Access: | https://pub.iapchem.org/ojs/index.php/JESE/article/view/2291 |