Process and Mechanism of Sealing 65 vol.% SiCp/ZL102 Composite and DM305 Electronic Glass with Borosilicate Glass
SiC-particulate-reinforced aluminum matrix composites (SiCp/Al MMCs) are widely used in the aerospace field due to their high specific stiffness and strength, low thermal expansion coefficient, and good radiation resistance. In the process of application and promotion, there is a connection problem...
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| Format: | Article |
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MDPI AG
2023-04-01
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| Series: | Metals |
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| Online Access: | https://www.mdpi.com/2075-4701/13/4/817 |
| _version_ | 1797604347350089728 |
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| author | Da Zhou Dongfeng Cheng Xiaoyu Hu Jitai Niu Dechao Qiu |
| author_facet | Da Zhou Dongfeng Cheng Xiaoyu Hu Jitai Niu Dechao Qiu |
| author_sort | Da Zhou |
| collection | DOAJ |
| description | SiC-particulate-reinforced aluminum matrix composites (SiCp/Al MMCs) are widely used in the aerospace field due to their high specific stiffness and strength, low thermal expansion coefficient, and good radiation resistance. In the process of application and promotion, there is a connection problem between the aluminum matrix composites and electronic glass. In this work, the lead-free SiO<sub>2</sub>-B<sub>2</sub>O<sub>3</sub>-Na<sub>2</sub>O glass filler was used to seal 65 vol.% SiCp/ZL102 composites and DM305 electronic glass in an atmospheric environment. The effects of the sealing temperature on the properties of the joints were studied by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). Additionally, the causes of defects and the fracture mechanisms of the joints were analyzed. The results showed that the glass filler and base material were connected through a dual mechanism of an Al, Na, Si, and O element diffusion reaction and a mechanical occlusion. At a sealing temperature of 540 °C and a holding time of 30 min, the joint interface was dense and crack-free. Meanwhile, the average shear strength reached 13.0 MPa, and the leakage rate of air tightness was 1 × 10<sup>−9</sup> Pa·m<sup>3</sup>/s. The brittle fracture features were revealed by the step-like morphology of the fracture, which originated from the brazing seam and propagated into the pore. The crack gradually propagated into the base material on both sides as the fracture area expanded, ultimately resulting in a fracture. |
| first_indexed | 2024-03-11T04:45:12Z |
| format | Article |
| id | doaj.art-f1d6d499f3f743408967995176537b0d |
| institution | Directory Open Access Journal |
| issn | 2075-4701 |
| language | English |
| last_indexed | 2024-03-11T04:45:12Z |
| publishDate | 2023-04-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Metals |
| spelling | doaj.art-f1d6d499f3f743408967995176537b0d2023-11-17T20:28:07ZengMDPI AGMetals2075-47012023-04-0113481710.3390/met13040817Process and Mechanism of Sealing 65 vol.% SiCp/ZL102 Composite and DM305 Electronic Glass with Borosilicate GlassDa Zhou0Dongfeng Cheng1Xiaoyu Hu2Jitai Niu3Dechao Qiu4School of Materials Science and Engineering, Henan Polytechnic University, Jiaozuo 454000, ChinaSchool of Materials Science and Engineering, Henan Polytechnic University, Jiaozuo 454000, ChinaSchool of Materials Science and Engineering, Henan Polytechnic University, Jiaozuo 454000, ChinaSchool of Materials Science and Engineering, Henan Polytechnic University, Jiaozuo 454000, ChinaSchool of Materials Science and Engineering, Henan Polytechnic University, Jiaozuo 454000, ChinaSiC-particulate-reinforced aluminum matrix composites (SiCp/Al MMCs) are widely used in the aerospace field due to their high specific stiffness and strength, low thermal expansion coefficient, and good radiation resistance. In the process of application and promotion, there is a connection problem between the aluminum matrix composites and electronic glass. In this work, the lead-free SiO<sub>2</sub>-B<sub>2</sub>O<sub>3</sub>-Na<sub>2</sub>O glass filler was used to seal 65 vol.% SiCp/ZL102 composites and DM305 electronic glass in an atmospheric environment. The effects of the sealing temperature on the properties of the joints were studied by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). Additionally, the causes of defects and the fracture mechanisms of the joints were analyzed. The results showed that the glass filler and base material were connected through a dual mechanism of an Al, Na, Si, and O element diffusion reaction and a mechanical occlusion. At a sealing temperature of 540 °C and a holding time of 30 min, the joint interface was dense and crack-free. Meanwhile, the average shear strength reached 13.0 MPa, and the leakage rate of air tightness was 1 × 10<sup>−9</sup> Pa·m<sup>3</sup>/s. The brittle fracture features were revealed by the step-like morphology of the fracture, which originated from the brazing seam and propagated into the pore. The crack gradually propagated into the base material on both sides as the fracture area expanded, ultimately resulting in a fracture.https://www.mdpi.com/2075-4701/13/4/817SiCp/Al MMCsDM305 electronic glassglass fillerlow-temperature sealingmechanical property |
| spellingShingle | Da Zhou Dongfeng Cheng Xiaoyu Hu Jitai Niu Dechao Qiu Process and Mechanism of Sealing 65 vol.% SiCp/ZL102 Composite and DM305 Electronic Glass with Borosilicate Glass Metals SiCp/Al MMCs DM305 electronic glass glass filler low-temperature sealing mechanical property |
| title | Process and Mechanism of Sealing 65 vol.% SiCp/ZL102 Composite and DM305 Electronic Glass with Borosilicate Glass |
| title_full | Process and Mechanism of Sealing 65 vol.% SiCp/ZL102 Composite and DM305 Electronic Glass with Borosilicate Glass |
| title_fullStr | Process and Mechanism of Sealing 65 vol.% SiCp/ZL102 Composite and DM305 Electronic Glass with Borosilicate Glass |
| title_full_unstemmed | Process and Mechanism of Sealing 65 vol.% SiCp/ZL102 Composite and DM305 Electronic Glass with Borosilicate Glass |
| title_short | Process and Mechanism of Sealing 65 vol.% SiCp/ZL102 Composite and DM305 Electronic Glass with Borosilicate Glass |
| title_sort | process and mechanism of sealing 65 vol sicp zl102 composite and dm305 electronic glass with borosilicate glass |
| topic | SiCp/Al MMCs DM305 electronic glass glass filler low-temperature sealing mechanical property |
| url | https://www.mdpi.com/2075-4701/13/4/817 |
| work_keys_str_mv | AT dazhou processandmechanismofsealing65volsicpzl102compositeanddm305electronicglasswithborosilicateglass AT dongfengcheng processandmechanismofsealing65volsicpzl102compositeanddm305electronicglasswithborosilicateglass AT xiaoyuhu processandmechanismofsealing65volsicpzl102compositeanddm305electronicglasswithborosilicateglass AT jitainiu processandmechanismofsealing65volsicpzl102compositeanddm305electronicglasswithborosilicateglass AT dechaoqiu processandmechanismofsealing65volsicpzl102compositeanddm305electronicglasswithborosilicateglass |