Multi-material additive manufacturing of electronics components: A bibliometric analysis
The study presents a bibliometric analysis of studies conducted on multi-materials printing of electronic components via additive manufacturing technologies. Using the R package and the associated biblioshiny, the study analyzed publications from Web of Science and Scopus. The study analyzed 405 res...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2023-09-01
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| Series: | Results in Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590123023004450 |
| _version_ | 1797682498687205376 |
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| author | Thywill Cephas Dzogbewu Nathaniel Amoah Sampson Afrifa Jnr Samuel Koranteng Fianko Deon Johan de Beer |
| author_facet | Thywill Cephas Dzogbewu Nathaniel Amoah Sampson Afrifa Jnr Samuel Koranteng Fianko Deon Johan de Beer |
| author_sort | Thywill Cephas Dzogbewu |
| collection | DOAJ |
| description | The study presents a bibliometric analysis of studies conducted on multi-materials printing of electronic components via additive manufacturing technologies. Using the R package and the associated biblioshiny, the study analyzed publications from Web of Science and Scopus. The study analyzed 405 research articles after removing 104 duplicates. The study applied performance analysis, keyword analysis, and network analysis. The performance analysis showed that the publications on multi-materials additive manufacturing are multi-disciplinary. Whilst the publications span almost three decades, most contributions started after 2015. The United States of America is the country with the highest production. The keyword analysis showed a changed focus before and after 2015. The trending topics show that the most recent trend is in the ‘aerospace industry’. Finally, the thematic analysis shows that the emerging themes in the area are interfaces, moisture, diffusion, microstructure, mechanical properties, and powder metallurgy. These emerging themes are discussed as they are conceived as the future directions of multi-materials printing of electronic components and devices. The current trend of research focuses on understanding and improving the interfacial bonding between the various multi-material interfaces. Overcoming the weak interfacial bonding issues would improve the mechanical properties of multi-materials electronic components. |
| first_indexed | 2024-03-12T00:00:36Z |
| format | Article |
| id | doaj.art-f24f25a36edd459986fc1fbd993bd979 |
| institution | Directory Open Access Journal |
| issn | 2590-1230 |
| language | English |
| last_indexed | 2024-03-12T00:00:36Z |
| publishDate | 2023-09-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Results in Engineering |
| spelling | doaj.art-f24f25a36edd459986fc1fbd993bd9792023-09-18T04:30:44ZengElsevierResults in Engineering2590-12302023-09-0119101318Multi-material additive manufacturing of electronics components: A bibliometric analysisThywill Cephas Dzogbewu0Nathaniel Amoah1Sampson Afrifa Jnr2Samuel Koranteng Fianko3Deon Johan de Beer4Department of Mechanical and Mechatronic Engineering, Faculty of Engineering, Built Environment and Information Technology, Central University of Technology, Bloemfontein, 9301, South Africa; Centre for Rapid Prototyping and Manufacturing, Central University of Technology, Bloemfontein, South Africa; Corresponding author. Department of Mechanical and Mechatronics Engineering, Faculty of Engineering, Built Environment and Information Technology, Central University of Technology, Bloemfontein 9301, South Africa.Department of Economics and Management, Universita Degli Studi di Brescia, 25121, Brescia, ItalyDepartment of Business Support Studies, Central University of Technology, Bloemfontein 9301, South AfricaDepartment of Business Support Studies, Central University of Technology, Bloemfontein 9301, South AfricaCentre for Rapid Prototyping and Manufacturing, Central University of Technology, Bloemfontein, South AfricaThe study presents a bibliometric analysis of studies conducted on multi-materials printing of electronic components via additive manufacturing technologies. Using the R package and the associated biblioshiny, the study analyzed publications from Web of Science and Scopus. The study analyzed 405 research articles after removing 104 duplicates. The study applied performance analysis, keyword analysis, and network analysis. The performance analysis showed that the publications on multi-materials additive manufacturing are multi-disciplinary. Whilst the publications span almost three decades, most contributions started after 2015. The United States of America is the country with the highest production. The keyword analysis showed a changed focus before and after 2015. The trending topics show that the most recent trend is in the ‘aerospace industry’. Finally, the thematic analysis shows that the emerging themes in the area are interfaces, moisture, diffusion, microstructure, mechanical properties, and powder metallurgy. These emerging themes are discussed as they are conceived as the future directions of multi-materials printing of electronic components and devices. The current trend of research focuses on understanding and improving the interfacial bonding between the various multi-material interfaces. Overcoming the weak interfacial bonding issues would improve the mechanical properties of multi-materials electronic components.http://www.sciencedirect.com/science/article/pii/S2590123023004450Multi-materialsAdditive manufacturingInterfacial bondElectronic componentsDissimilar materialsMechanical interlocking |
| spellingShingle | Thywill Cephas Dzogbewu Nathaniel Amoah Sampson Afrifa Jnr Samuel Koranteng Fianko Deon Johan de Beer Multi-material additive manufacturing of electronics components: A bibliometric analysis Results in Engineering Multi-materials Additive manufacturing Interfacial bond Electronic components Dissimilar materials Mechanical interlocking |
| title | Multi-material additive manufacturing of electronics components: A bibliometric analysis |
| title_full | Multi-material additive manufacturing of electronics components: A bibliometric analysis |
| title_fullStr | Multi-material additive manufacturing of electronics components: A bibliometric analysis |
| title_full_unstemmed | Multi-material additive manufacturing of electronics components: A bibliometric analysis |
| title_short | Multi-material additive manufacturing of electronics components: A bibliometric analysis |
| title_sort | multi material additive manufacturing of electronics components a bibliometric analysis |
| topic | Multi-materials Additive manufacturing Interfacial bond Electronic components Dissimilar materials Mechanical interlocking |
| url | http://www.sciencedirect.com/science/article/pii/S2590123023004450 |
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