A review of carbon-based thermal interface materials: Mechanism, thermal measurements and thermal properties
With the development of electronic technologies, electronic devices become smaller, while their power density increases dramatically. The resulting excessive heat requires excellent heat dissipation to ensure great performance of the devices. A good thermal interface material (TIM), with excellent b...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-11-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127521004901 |