Sn-0.7Cu-10Bi Solder Modification Strategy by Cr Addition
The application of Sn-0.7Cu-based composite solder in electronic packaging is limited due to its high melting point, poor wettability and low mechanical properties. Herein, we propose a strategy of adding Bi and Cr to improve the solderability of Sn-0.7Cu lead-free solder. The results show that the...
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-10-01
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| Series: | Metals |
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| Online Access: | https://www.mdpi.com/2075-4701/12/10/1768 |
| _version_ | 1797471392028950528 |
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| author | Pin Han Zhenpo Lu Xuping Zhang |
| author_facet | Pin Han Zhenpo Lu Xuping Zhang |
| author_sort | Pin Han |
| collection | DOAJ |
| description | The application of Sn-0.7Cu-based composite solder in electronic packaging is limited due to its high melting point, poor wettability and low mechanical properties. Herein, we propose a strategy of adding Bi and Cr to improve the solderability of Sn-0.7Cu lead-free solder. The results show that the addition of Bi reduces the melting point of the composite solder. Moreover, the Cr particles adsorb at the interface between solder and substrate, thereby reducing the wetting angle of the composite solder. The wetting angle reaches a minimum value of 25.84° when the content of Cr is 0.2 wt.%. The addition of Bi and Cr changes the microstructure of the composite solder. The nucleation rate of β-Sn rises with the increase of Cr content, thus decreasing the size of β-Sn. Furthermore, the addition of Bi and Cr reduces the thickness of the intermetallic compounds (IMCs). This is due to the adsorption of Bi and Cr at the interface of IMCs hinders the atomic diffusion channels and inhibits the growth of IMCs. |
| first_indexed | 2024-03-09T19:47:49Z |
| format | Article |
| id | doaj.art-f2b5e740a88f462da660e0acc0746429 |
| institution | Directory Open Access Journal |
| issn | 2075-4701 |
| language | English |
| last_indexed | 2024-03-09T19:47:49Z |
| publishDate | 2022-10-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Metals |
| spelling | doaj.art-f2b5e740a88f462da660e0acc07464292023-11-24T01:20:26ZengMDPI AGMetals2075-47012022-10-011210176810.3390/met12101768Sn-0.7Cu-10Bi Solder Modification Strategy by Cr AdditionPin Han0Zhenpo Lu1Xuping Zhang2Technical Center of Earthmoving Machinery Division, Xuzhou Construction Machinery Group, Xuzhou 221001, ChinaTechnical Center of Earthmoving Machinery Division, Xuzhou Construction Machinery Group, Xuzhou 221001, ChinaSchool of Materials and Physics, China University of Mining & Technology, Xuzhou 221116, ChinaThe application of Sn-0.7Cu-based composite solder in electronic packaging is limited due to its high melting point, poor wettability and low mechanical properties. Herein, we propose a strategy of adding Bi and Cr to improve the solderability of Sn-0.7Cu lead-free solder. The results show that the addition of Bi reduces the melting point of the composite solder. Moreover, the Cr particles adsorb at the interface between solder and substrate, thereby reducing the wetting angle of the composite solder. The wetting angle reaches a minimum value of 25.84° when the content of Cr is 0.2 wt.%. The addition of Bi and Cr changes the microstructure of the composite solder. The nucleation rate of β-Sn rises with the increase of Cr content, thus decreasing the size of β-Sn. Furthermore, the addition of Bi and Cr reduces the thickness of the intermetallic compounds (IMCs). This is due to the adsorption of Bi and Cr at the interface of IMCs hinders the atomic diffusion channels and inhibits the growth of IMCs.https://www.mdpi.com/2075-4701/12/10/1768Sn-0.7Cu soldermelting pointwettabilitymicrostructureinterfacial reaction |
| spellingShingle | Pin Han Zhenpo Lu Xuping Zhang Sn-0.7Cu-10Bi Solder Modification Strategy by Cr Addition Metals Sn-0.7Cu solder melting point wettability microstructure interfacial reaction |
| title | Sn-0.7Cu-10Bi Solder Modification Strategy by Cr Addition |
| title_full | Sn-0.7Cu-10Bi Solder Modification Strategy by Cr Addition |
| title_fullStr | Sn-0.7Cu-10Bi Solder Modification Strategy by Cr Addition |
| title_full_unstemmed | Sn-0.7Cu-10Bi Solder Modification Strategy by Cr Addition |
| title_short | Sn-0.7Cu-10Bi Solder Modification Strategy by Cr Addition |
| title_sort | sn 0 7cu 10bi solder modification strategy by cr addition |
| topic | Sn-0.7Cu solder melting point wettability microstructure interfacial reaction |
| url | https://www.mdpi.com/2075-4701/12/10/1768 |
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