Copper electrodeposition from a copper acid baths in the presence of PEG and NaCl
Copper electrodeposition from copper acid solutions containing PEG and NaCl has been investigated onto Cu(111), Cu(100) and polycrystalline copper electrodes using polarization and EIS measurements. The adsorption of sulphate and chloride anions, and PEG molecules, was investigated onto...
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| Format: | Article |
| Language: | English |
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Serbian Chemical Society
2001-01-01
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| Series: | Journal of the Serbian Chemical Society |
| Subjects: | |
| Online Access: | http://www.doiserbia.nb.rs/img/doi/0352-5139/2001/0352-51390112935J.pdf |
| _version_ | 1818950036295254016 |
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| author | Jović V.D. Jović B.M. |
| author_facet | Jović V.D. Jović B.M. |
| author_sort | Jović V.D. |
| collection | DOAJ |
| description | Copper electrodeposition from copper acid solutions containing PEG and NaCl
has been investigated onto Cu(111), Cu(100) and polycrystalline copper
electrodes using polarization and EIS measurements. The adsorption of
sulphate and chloride anions, and PEG molecules, was investigated onto
Cu(111) and Cu(100) by cyclic voltammetry and differential capacitance
measurements. Differential capacitance vs. potential curves recorded onto
Cu(100) in solutions containing 0.1 M H2SO4, 0.1 M H2SO4 + 10-3 M PEG and
0.1MH2SO4 + 10-3MPEG + 10-3MNaCl confirm that “specific adsorption”
of PEG molecules occurs in the absence of NaCl in the solution, in the
potential region of copper electrodeposition, e.g., between -1.0 V and -0.5
V vs. SSE. In the presence of chloride ions, the adsorption of PEG molecules
is suppressed and there is no evidence of adsorption of neutral PEG
molecules. It is shown that hysteresis, appearing on the polarization curves
of copper electrodeposition, is not a consequence of competition between
inhibition provided by the Cl-PEG/Cu2+/Cu+/Cu interface and the catalytic
effects of Cl-MPSA/Cu2+/Cu+/Cu interaction, because hysteresis is present in
the solution containing only PEG and NaCl, e.g., in the absence of MPSA. EIS
measurements confirm the simultaneous occurrence of two processes during
copper electrodeposition: deposition of copper by discharge of Cu2+ ions and
“specific adsorption” and discharge of some heavily charged species, most
probably containing Cu, PEG and Cl. |
| first_indexed | 2024-12-20T09:12:12Z |
| format | Article |
| id | doaj.art-f33f06bfddf941eb94717f8aeea5c999 |
| institution | Directory Open Access Journal |
| issn | 0352-5139 1820-7421 |
| language | English |
| last_indexed | 2024-12-20T09:12:12Z |
| publishDate | 2001-01-01 |
| publisher | Serbian Chemical Society |
| record_format | Article |
| series | Journal of the Serbian Chemical Society |
| spelling | doaj.art-f33f06bfddf941eb94717f8aeea5c9992022-12-21T19:45:32ZengSerbian Chemical SocietyJournal of the Serbian Chemical Society0352-51391820-74212001-01-016611-1293595210.2298/JSC0112935J0352-51390112935JCopper electrodeposition from a copper acid baths in the presence of PEG and NaClJović V.D.0Jović B.M.1Drexel University, Materials Engineering Department, Philadelphia, USADrexel University, Materials Engineering Department, Philadelphia, USACopper electrodeposition from copper acid solutions containing PEG and NaCl has been investigated onto Cu(111), Cu(100) and polycrystalline copper electrodes using polarization and EIS measurements. The adsorption of sulphate and chloride anions, and PEG molecules, was investigated onto Cu(111) and Cu(100) by cyclic voltammetry and differential capacitance measurements. Differential capacitance vs. potential curves recorded onto Cu(100) in solutions containing 0.1 M H2SO4, 0.1 M H2SO4 + 10-3 M PEG and 0.1MH2SO4 + 10-3MPEG + 10-3MNaCl confirm that “specific adsorption” of PEG molecules occurs in the absence of NaCl in the solution, in the potential region of copper electrodeposition, e.g., between -1.0 V and -0.5 V vs. SSE. In the presence of chloride ions, the adsorption of PEG molecules is suppressed and there is no evidence of adsorption of neutral PEG molecules. It is shown that hysteresis, appearing on the polarization curves of copper electrodeposition, is not a consequence of competition between inhibition provided by the Cl-PEG/Cu2+/Cu+/Cu interface and the catalytic effects of Cl-MPSA/Cu2+/Cu+/Cu interaction, because hysteresis is present in the solution containing only PEG and NaCl, e.g., in the absence of MPSA. EIS measurements confirm the simultaneous occurrence of two processes during copper electrodeposition: deposition of copper by discharge of Cu2+ ions and “specific adsorption” and discharge of some heavily charged species, most probably containing Cu, PEG and Cl.http://www.doiserbia.nb.rs/img/doi/0352-5139/2001/0352-51390112935J.pdfcopperelectrodepositionpegchloridecomplexescu(111)cu(100)adsorptiondifferential capacitance |
| spellingShingle | Jović V.D. Jović B.M. Copper electrodeposition from a copper acid baths in the presence of PEG and NaCl Journal of the Serbian Chemical Society copper electrodeposition peg chloride complexes cu(111) cu(100) adsorption differential capacitance |
| title | Copper electrodeposition from a copper acid baths in the presence of PEG and NaCl |
| title_full | Copper electrodeposition from a copper acid baths in the presence of PEG and NaCl |
| title_fullStr | Copper electrodeposition from a copper acid baths in the presence of PEG and NaCl |
| title_full_unstemmed | Copper electrodeposition from a copper acid baths in the presence of PEG and NaCl |
| title_short | Copper electrodeposition from a copper acid baths in the presence of PEG and NaCl |
| title_sort | copper electrodeposition from a copper acid baths in the presence of peg and nacl |
| topic | copper electrodeposition peg chloride complexes cu(111) cu(100) adsorption differential capacitance |
| url | http://www.doiserbia.nb.rs/img/doi/0352-5139/2001/0352-51390112935J.pdf |
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