Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

The joining of lead-free Sn-3.0Ag-0.5Cu (SAC305) solder alloy to metal substrate with the addition of a porous Cu interlayer was investigated. Two types of porous Cu interlayers, namely 15 ppi—pore per inch (P15) and 25 ppi (P25) were sandwiched in between SAC305/Cu substrate. The soldering process...

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Bibliographic Details
Main Authors: Nashrah Hani Jamadon, Ai Wen Tan, Farazila Yusof, Tadashi Ariga, Yukio Miyashita, Mohd Hamdi
Format: Article
Language:English
Published: MDPI AG 2016-09-01
Series:Metals
Subjects:
porous Cu interlayer
Sn-3.0Ag-0.5Cu solder alloy
joint strength
fracture morphology
Online Access:http://www.mdpi.com/2075-4701/6/9/220

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