A Parametric Study on the Elliptical hole Effects of Laminate Composite Plates under Thermal Buckling Load

In this study, a thermal buckling analysis of laminate composite square plate was performed with elliptical hole cutout using the finite element method. Graphite/Epoxy laminate plate used in this study is symmetrical stacking sequence plate [(0/90)2]s. This laminate square plate was subjected to tem...

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Main Authors: Chhorn Buntheng, Jung WooYoung
Format: Article
Language:English
Published: De Gruyter 2020-06-01
Series:Science and Engineering of Composite Materials
Subjects:
Online Access:https://doi.org/10.1515/secm-2020-0019
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author Chhorn Buntheng
Jung WooYoung
author_facet Chhorn Buntheng
Jung WooYoung
author_sort Chhorn Buntheng
collection DOAJ
description In this study, a thermal buckling analysis of laminate composite square plate was performed with elliptical hole cutout using the finite element method. Graphite/Epoxy laminate plate used in this study is symmetrical stacking sequence plate [(0/90)2]s. This laminate square plate was subjected to temperature loading with clamped support on all edges. Moreover, the parameters considered were fiber orientation (θ), a/b ratio (elliptical hole), elliptical hole inclination (φ), thermal expansion coefficient ratio (α1/α2), and thickness of plates (t). The results showed that as the thermal expansion coefficient ratio changes, the elliptical hole ratio and the elliptical hole inclination have inconsequential effects on the performance of the resistance of laminate composite plates. The maximum values of thermal buckling amplification factor were obtained when the ratio a/b = 1.0, which is a circle cutout,while the minimum values were obtained when the ratio a/b = 0.5, regardless of the thickness of plates. Moreover, the plate with elliptical or circle cutout hole provides about 4% to 9% higher buckling resistance than that of the plate without hole cutout, because when subjected to temperature loading the plate with hole can release stress better than the plate without hole.
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spelling doaj.art-f3e8984cca50408c96560e4f171509e42022-12-21T18:23:52ZengDe GruyterScience and Engineering of Composite Materials0792-12332191-03592020-06-0127119620310.1515/secm-2020-0019secm-2020-0019A Parametric Study on the Elliptical hole Effects of Laminate Composite Plates under Thermal Buckling LoadChhorn Buntheng0Jung WooYoung1Gangneung-Wonju National University, College of Engineering, Building No. 2, Room 128, Gangneung city, Gangwon province [25457], KoreaGangneung-Wonju National University, College of Engineering, Building No. 2, Room 110, Gangneung city, Gangwon province [25457], KoreaIn this study, a thermal buckling analysis of laminate composite square plate was performed with elliptical hole cutout using the finite element method. Graphite/Epoxy laminate plate used in this study is symmetrical stacking sequence plate [(0/90)2]s. This laminate square plate was subjected to temperature loading with clamped support on all edges. Moreover, the parameters considered were fiber orientation (θ), a/b ratio (elliptical hole), elliptical hole inclination (φ), thermal expansion coefficient ratio (α1/α2), and thickness of plates (t). The results showed that as the thermal expansion coefficient ratio changes, the elliptical hole ratio and the elliptical hole inclination have inconsequential effects on the performance of the resistance of laminate composite plates. The maximum values of thermal buckling amplification factor were obtained when the ratio a/b = 1.0, which is a circle cutout,while the minimum values were obtained when the ratio a/b = 0.5, regardless of the thickness of plates. Moreover, the plate with elliptical or circle cutout hole provides about 4% to 9% higher buckling resistance than that of the plate without hole cutout, because when subjected to temperature loading the plate with hole can release stress better than the plate without hole.https://doi.org/10.1515/secm-2020-0019thermal bucklinglaminate compositeelliptical holefem
spellingShingle Chhorn Buntheng
Jung WooYoung
A Parametric Study on the Elliptical hole Effects of Laminate Composite Plates under Thermal Buckling Load
Science and Engineering of Composite Materials
thermal buckling
laminate composite
elliptical hole
fem
title A Parametric Study on the Elliptical hole Effects of Laminate Composite Plates under Thermal Buckling Load
title_full A Parametric Study on the Elliptical hole Effects of Laminate Composite Plates under Thermal Buckling Load
title_fullStr A Parametric Study on the Elliptical hole Effects of Laminate Composite Plates under Thermal Buckling Load
title_full_unstemmed A Parametric Study on the Elliptical hole Effects of Laminate Composite Plates under Thermal Buckling Load
title_short A Parametric Study on the Elliptical hole Effects of Laminate Composite Plates under Thermal Buckling Load
title_sort parametric study on the elliptical hole effects of laminate composite plates under thermal buckling load
topic thermal buckling
laminate composite
elliptical hole
fem
url https://doi.org/10.1515/secm-2020-0019
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AT jungwooyoung aparametricstudyontheellipticalholeeffectsoflaminatecompositeplatesunderthermalbucklingload
AT chhornbuntheng parametricstudyontheellipticalholeeffectsoflaminatecompositeplatesunderthermalbucklingload
AT jungwooyoung parametricstudyontheellipticalholeeffectsoflaminatecompositeplatesunderthermalbucklingload