Microwave-Enabled Wearables: Underpinning Technologies, Integration Platforms, and Next-Generation Roadmap
This paper presents a holistic and authoritative review of the role of microwave technologies in enabling a new generation of wearable devices. A human-centric Internet of Things (IoT) covering remote healthcare, distributed sensing, and consumer electronics, calls for high-performance wearable devi...
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| Format: | Article |
| Language: | English |
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IEEE
2023-01-01
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| Series: | IEEE Journal of Microwaves |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9983811/ |
| _version_ | 1797960315354218496 |
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| author | Mahmoud Wagih Leonardo Balocchi Francesca Benassi Nuno B. Carvalho Jung-Chih Chiao Ricardo Correia Alessandra Costanzo Yepu Cui Dimitra Georgiadou Carolina Gouveia Jasmin Grosinger John S. Ho Kexin Hu Abiodun Komolafe Sam Lemey Caroline Loss Gaetano Marrocco Paul Mitcheson Valentina Palazzi Nicoletta Panunzio Giacomo Paolini Pedro Pinho Josef Preishuber-Pflugl Yasser Qaragoez Hamed Rahmani Hendrik Rogier Jose Romero Lopera Luca Roselli Dominique Schreurs Manos Tentzeris Xi Tian Russel Torah Ricardo Torres Patrick Van Torre Dieff Vital Steve Beeby |
| author_facet | Mahmoud Wagih Leonardo Balocchi Francesca Benassi Nuno B. Carvalho Jung-Chih Chiao Ricardo Correia Alessandra Costanzo Yepu Cui Dimitra Georgiadou Carolina Gouveia Jasmin Grosinger John S. Ho Kexin Hu Abiodun Komolafe Sam Lemey Caroline Loss Gaetano Marrocco Paul Mitcheson Valentina Palazzi Nicoletta Panunzio Giacomo Paolini Pedro Pinho Josef Preishuber-Pflugl Yasser Qaragoez Hamed Rahmani Hendrik Rogier Jose Romero Lopera Luca Roselli Dominique Schreurs Manos Tentzeris Xi Tian Russel Torah Ricardo Torres Patrick Van Torre Dieff Vital Steve Beeby |
| author_sort | Mahmoud Wagih |
| collection | DOAJ |
| description | This paper presents a holistic and authoritative review of the role of microwave technologies in enabling a new generation of wearable devices. A human-centric Internet of Things (IoT) covering remote healthcare, distributed sensing, and consumer electronics, calls for high-performance wearable devices integrated into clothing, which require interdisciplinary research efforts to emerge. Microwaves, the “interconnect” of wireless networks, can enable, rather than solely connect, the next generation of autonomous, sustainable, and wearable-friendly electronics. First, enabling technologies including wireless power transmission and RF energy harvesting, backscattering and passive communication, RFID, and electromagnetic sensing are reviewed. We then discuss the key integration platforms, covering smart fabrics and electronic textiles, additive manufacturing, printed electronics, natively-flexible and organic RF semiconductors, and fully-integrated CMOS systems, where opportunities for hybrid integration are highlighted. The emerging research trends, from mmWave 6G, RF sensing and imaging, to healthcare applications including neural implants, drug delivery, and safety upon exposure to microwaves are re-visited and discussed, presenting a future roadmap for interdisciplinary research towards sustainable and reliable next-generation wearables. |
| first_indexed | 2024-04-11T00:44:09Z |
| format | Article |
| id | doaj.art-f46678e89a2c4f30966c10e090317cac |
| institution | Directory Open Access Journal |
| issn | 2692-8388 |
| language | English |
| last_indexed | 2024-04-11T00:44:09Z |
| publishDate | 2023-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Journal of Microwaves |
| spelling | doaj.art-f46678e89a2c4f30966c10e090317cac2023-01-06T00:00:52ZengIEEEIEEE Journal of Microwaves2692-83882023-01-013119322610.1109/JMW.2022.32232549983811Microwave-Enabled Wearables: Underpinning Technologies, Integration Platforms, and Next-Generation RoadmapMahmoud Wagih0https://orcid.org/0000-0002-7806-4333Leonardo Balocchi1https://orcid.org/0000-0001-5747-2445Francesca Benassi2https://orcid.org/0000-0002-5870-0355Nuno B. Carvalho3https://orcid.org/0000-0002-7402-2099Jung-Chih Chiao4https://orcid.org/0000-0001-9670-0340Ricardo Correia5https://orcid.org/0000-0003-3767-4538Alessandra Costanzo6https://orcid.org/0000-0001-5073-000XYepu Cui7https://orcid.org/0000-0001-6961-4885Dimitra Georgiadou8https://orcid.org/0000-0002-2620-3346Carolina Gouveia9https://orcid.org/0000-0002-2077-2871Jasmin Grosinger10https://orcid.org/0000-0003-1639-5919John S. Ho11https://orcid.org/0000-0002-9458-9033Kexin Hu12Abiodun Komolafe13https://orcid.org/0000-0002-3618-2390Sam Lemey14https://orcid.org/0000-0003-1366-2604Caroline Loss15Gaetano Marrocco16https://orcid.org/0000-0003-3151-3071Paul Mitcheson17https://orcid.org/0000-0002-0483-7129Valentina Palazzi18https://orcid.org/0000-0001-8184-8297Nicoletta Panunzio19https://orcid.org/0000-0002-5638-1856Giacomo Paolini20https://orcid.org/0000-0002-5001-2689Pedro Pinho21https://orcid.org/0000-0001-5588-7794Josef Preishuber-Pflugl22Yasser Qaragoez23Hamed Rahmani24https://orcid.org/0000-0002-3498-9000Hendrik Rogier25https://orcid.org/0000-0001-8139-2736Jose Romero Lopera26https://orcid.org/0000-0001-7641-104XLuca Roselli27https://orcid.org/0000-0002-2692-547XDominique Schreurs28https://orcid.org/0000-0002-4018-7936Manos Tentzeris29https://orcid.org/0000-0003-0476-3577Xi Tian30https://orcid.org/0000-0003-1633-1210Russel Torah31https://orcid.org/0000-0002-5598-2860Ricardo Torres32https://orcid.org/0000-0001-9881-5264Patrick Van Torre33https://orcid.org/0000-0002-0633-0815Dieff Vital34Steve Beeby35https://orcid.org/0000-0002-0800-1759James Watt School of Engineering, University of Glasgow, Glasgow, U.K.Department of Engineering, University of Perugia, Perugia, ItalyDepartment of Electrical, Electronic, and Information Engineering, University of Bologna, Bologna, BO, ItalyDepartamento de Eletrónica, Telecomunicações e Informática, Universidade de Aveiro, Aveiro, PortugalSouthern Methodist University, Dallas, TX, USAInstituto de Telecomunicações, Aveiro, PortugalDepartment of Electrical, Electronic, and Information Engineering, University of Bologna, Bologna, BO, ItalySchool of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USASchool of Electronics and Computer Science, University of Southampton, Southampton, U.K.Departamento de Eletrónica, Telecomunicações e Informática, Universidade de Aveiro, Aveiro, PortugalInstitute of Microwave and Photonic Engineering, Graz University of Technology, Graz, AustriaDepartment of Electrical and Computer Engineering, National University of Singapore, SingaporeSchool of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USASchool of Electronics and Computer Science, University of Southampton, Southampton, U.K.IDLab-Electromagnetics group, Ghent University-imec, Gent, BelgiumArts Department, FibEnTech Research Unit, Universidade da Beira Interior, Covilhã, PortugalPervasive Electromagnetics Lab, Department of Civil Engineering and Computer Science Engineering, University of Rome Tor Vergata, Rome, ItalyWireless Power Lab, Department of Electrical and Electronic Engineering, Imperial College London, London, U.K.Department of Engineering, University of Perugia, Perugia, ItalyPervasive Electromagnetics Lab, Department of Civil Engineering and Computer Science Engineering, University of Rome Tor Vergata, Rome, ItalyDepartment of Electrical, Electronic, and Information Engineering, University of Bologna, Bologna, BO, ItalyDepartamento de Eletrónica, Telecomunicações e Informática, Universidade de Aveiro, Aveiro, PortugalCISC Semiconductor GmbH, Klagenfurt, AustriaDivision ESAT-WAVECORE, KU Leuven, Leuven, BelgiumIBM T. J. Watson Research Center, Yorktown Heights, NY, USAIDLab-Electromagnetics group, Ghent University-imec, Gent, BelgiumInstitute of Microwave and Photonic Engineering, Graz University of Technology, Graz, AustriaDepartment of Engineering, University of Perugia, Perugia, ItalyDivision ESAT-WAVECORE, KU Leuven, Leuven, BelgiumSchool of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USADepartment of Electrical and Computer Engineering, National University of Singapore, SingaporeSchool of Electronics and Computer Science, University of Southampton, Southampton, U.K.Departamento de Eletrónica, Telecomunicações e Informática, Universidade de Aveiro, Aveiro, PortugalIDLab-Electromagnetics group, Ghent University-imec, Gent, BelgiumDepartment of Electrical and Computer Engineering, University of Illinois Chicago, Chicago, IL, USASchool of Electronics and Computer Science, University of Southampton, Southampton, U.K.This paper presents a holistic and authoritative review of the role of microwave technologies in enabling a new generation of wearable devices. A human-centric Internet of Things (IoT) covering remote healthcare, distributed sensing, and consumer electronics, calls for high-performance wearable devices integrated into clothing, which require interdisciplinary research efforts to emerge. Microwaves, the “interconnect” of wireless networks, can enable, rather than solely connect, the next generation of autonomous, sustainable, and wearable-friendly electronics. First, enabling technologies including wireless power transmission and RF energy harvesting, backscattering and passive communication, RFID, and electromagnetic sensing are reviewed. We then discuss the key integration platforms, covering smart fabrics and electronic textiles, additive manufacturing, printed electronics, natively-flexible and organic RF semiconductors, and fully-integrated CMOS systems, where opportunities for hybrid integration are highlighted. The emerging research trends, from mmWave 6G, RF sensing and imaging, to healthcare applications including neural implants, drug delivery, and safety upon exposure to microwaves are re-visited and discussed, presenting a future roadmap for interdisciplinary research towards sustainable and reliable next-generation wearables.https://ieeexplore.ieee.org/document/9983811/Additive manufacturingantennasbackscatteringenergy harvestingE-textilesflexible semiconductors |
| spellingShingle | Mahmoud Wagih Leonardo Balocchi Francesca Benassi Nuno B. Carvalho Jung-Chih Chiao Ricardo Correia Alessandra Costanzo Yepu Cui Dimitra Georgiadou Carolina Gouveia Jasmin Grosinger John S. Ho Kexin Hu Abiodun Komolafe Sam Lemey Caroline Loss Gaetano Marrocco Paul Mitcheson Valentina Palazzi Nicoletta Panunzio Giacomo Paolini Pedro Pinho Josef Preishuber-Pflugl Yasser Qaragoez Hamed Rahmani Hendrik Rogier Jose Romero Lopera Luca Roselli Dominique Schreurs Manos Tentzeris Xi Tian Russel Torah Ricardo Torres Patrick Van Torre Dieff Vital Steve Beeby Microwave-Enabled Wearables: Underpinning Technologies, Integration Platforms, and Next-Generation Roadmap IEEE Journal of Microwaves Additive manufacturing antennas backscattering energy harvesting E-textiles flexible semiconductors |
| title | Microwave-Enabled Wearables: Underpinning Technologies, Integration Platforms, and Next-Generation Roadmap |
| title_full | Microwave-Enabled Wearables: Underpinning Technologies, Integration Platforms, and Next-Generation Roadmap |
| title_fullStr | Microwave-Enabled Wearables: Underpinning Technologies, Integration Platforms, and Next-Generation Roadmap |
| title_full_unstemmed | Microwave-Enabled Wearables: Underpinning Technologies, Integration Platforms, and Next-Generation Roadmap |
| title_short | Microwave-Enabled Wearables: Underpinning Technologies, Integration Platforms, and Next-Generation Roadmap |
| title_sort | microwave enabled wearables underpinning technologies integration platforms and next generation roadmap |
| topic | Additive manufacturing antennas backscattering energy harvesting E-textiles flexible semiconductors |
| url | https://ieeexplore.ieee.org/document/9983811/ |
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