Progress of Polymer-Based Thermally Conductive Materials by Fused Filament Fabrication: A Comprehensive Review
With the miniaturization and integration of electronic products, the heat dissipation efficiency of electronic equipment needs to be further improved. Notably, polymer materials are a choice for electronic equipment matrices because of their advantages of low cost and wide application availability....
Main Authors: | Zewei Cai, Naveen Thirunavukkarasu, Xuefeng Diao, Haoran Wang, Lixin Wu, Chen Zhang, Jianlei Wang |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2022-10-01
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Series: | Polymers |
Subjects: | |
Online Access: | https://www.mdpi.com/2073-4360/14/20/4297 |
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