Automotive Power Module Packaging: Current Status and Future Trends
Semiconductor power modules are core components of power electronics in electrified vehicles. Packaging technology often has a critical impact on module performance and reliability. This paper presents a comprehensive review of the automotive power module packaging technologies. The first part of th...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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IEEE
2020-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9178734/ |
| _version_ | 1818917710359166976 |
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| author | Yuhang Yang Lea Dorn-Gomba Romina Rodriguez Christopher Mak Ali Emadi |
| author_facet | Yuhang Yang Lea Dorn-Gomba Romina Rodriguez Christopher Mak Ali Emadi |
| author_sort | Yuhang Yang |
| collection | DOAJ |
| description | Semiconductor power modules are core components of power electronics in electrified vehicles. Packaging technology often has a critical impact on module performance and reliability. This paper presents a comprehensive review of the automotive power module packaging technologies. The first part of this paper discusses the driving factors of packaging technology development. In the second section, the design considerations and a primary design process of module packaging are summarized. Besides, major packaging components, such as semiconductor dies, substrates, and die bonding, are introduced based on the conventional packaging structure. Next, technical details and innovative features of state-of-the-art automotive power modules from major suppliers and original equipment manufacturers are reviewed. Most of these modules have been applied in commercial vehicles. In the fourth part, the system integration concept, printed circuit board embedded packaging, three-dimensional packaging, press pack packaging, and advanced materials are categorized as promising trends for automotive applications. The advantages and drawbacks of these trends are discussed, and it is concluded that a preferable overall performance could be achieved by combining multiple technologies. |
| first_indexed | 2024-12-20T00:38:24Z |
| format | Article |
| id | doaj.art-f4be7a9dfea444d7bc4cb82c1a5f0298 |
| institution | Directory Open Access Journal |
| issn | 2169-3536 |
| language | English |
| last_indexed | 2024-12-20T00:38:24Z |
| publishDate | 2020-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Access |
| spelling | doaj.art-f4be7a9dfea444d7bc4cb82c1a5f02982022-12-21T19:59:41ZengIEEEIEEE Access2169-35362020-01-01816012616014410.1109/ACCESS.2020.30197759178734Automotive Power Module Packaging: Current Status and Future TrendsYuhang Yang0https://orcid.org/0000-0002-3268-131XLea Dorn-Gomba1https://orcid.org/0000-0001-9954-0135Romina Rodriguez2https://orcid.org/0000-0003-2315-3440Christopher Mak3Ali Emadi4https://orcid.org/0000-0002-0676-1455Department of Mechanical Engineering, McMaster University, Hamilton, ON, CanadaDepartment of Electrical and Computer Engineering, McMaster University, Hamilton, ON, CanadaDepartment of Mechanical Engineering, McMaster University, Hamilton, ON, CanadaDepartment of Electrical and Computer Engineering, McMaster University, Hamilton, ON, CanadaDepartment of Mechanical Engineering, McMaster University, Hamilton, ON, CanadaSemiconductor power modules are core components of power electronics in electrified vehicles. Packaging technology often has a critical impact on module performance and reliability. This paper presents a comprehensive review of the automotive power module packaging technologies. The first part of this paper discusses the driving factors of packaging technology development. In the second section, the design considerations and a primary design process of module packaging are summarized. Besides, major packaging components, such as semiconductor dies, substrates, and die bonding, are introduced based on the conventional packaging structure. Next, technical details and innovative features of state-of-the-art automotive power modules from major suppliers and original equipment manufacturers are reviewed. Most of these modules have been applied in commercial vehicles. In the fourth part, the system integration concept, printed circuit board embedded packaging, three-dimensional packaging, press pack packaging, and advanced materials are categorized as promising trends for automotive applications. The advantages and drawbacks of these trends are discussed, and it is concluded that a preferable overall performance could be achieved by combining multiple technologies.https://ieeexplore.ieee.org/document/9178734/Electric vehiclespower electronicssemiconductor device packaging |
| spellingShingle | Yuhang Yang Lea Dorn-Gomba Romina Rodriguez Christopher Mak Ali Emadi Automotive Power Module Packaging: Current Status and Future Trends IEEE Access Electric vehicles power electronics semiconductor device packaging |
| title | Automotive Power Module Packaging: Current Status and Future Trends |
| title_full | Automotive Power Module Packaging: Current Status and Future Trends |
| title_fullStr | Automotive Power Module Packaging: Current Status and Future Trends |
| title_full_unstemmed | Automotive Power Module Packaging: Current Status and Future Trends |
| title_short | Automotive Power Module Packaging: Current Status and Future Trends |
| title_sort | automotive power module packaging current status and future trends |
| topic | Electric vehicles power electronics semiconductor device packaging |
| url | https://ieeexplore.ieee.org/document/9178734/ |
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