Creep Crack Growth Behavior during Hot Water Immersion of an Epoxy Adhesive Using a Spring-Loaded Double Cantilever Beam Test Method

Double cantilever beam (DCB) tests were conducted by immersing the specimens in temperature-controlled water while applying a creep load using a spring. By introducing a data reduction scheme to the spring-loaded DCB test method, it was confirmed that only a single parameter measurement was sufficie...

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Main Authors: Kota Nakamura, Yu Sekiguchi, Kazumasa Shimamoto, Keiji Houjou, Haruhisa Akiyama, Chiaki Sato
Format: Article
Language:English
Published: MDPI AG 2023-01-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/16/2/607
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author Kota Nakamura
Yu Sekiguchi
Kazumasa Shimamoto
Keiji Houjou
Haruhisa Akiyama
Chiaki Sato
author_facet Kota Nakamura
Yu Sekiguchi
Kazumasa Shimamoto
Keiji Houjou
Haruhisa Akiyama
Chiaki Sato
author_sort Kota Nakamura
collection DOAJ
description Double cantilever beam (DCB) tests were conducted by immersing the specimens in temperature-controlled water while applying a creep load using a spring. By introducing a data reduction scheme to the spring-loaded DCB test method, it was confirmed that only a single parameter measurement was sufficient to calculate the energy release rate (ERR). Aluminum alloy substrates bonded with an epoxy adhesive were used, and DCB tests were performed by changing the initial load values, spring constants, and immersion temperatures for two types of surface treatment. The initial applied load and spring constant had no effect on the ERR threshold. In contrast, the threshold decreased with the increasing immersion temperature, but even in the worst case, it was 15% of the critical ERR in the static tests. Using the creep crack growth relationship, it was revealed that there were three phases of creep immersion crack growth in the adhesive joints, and each phase was affected by the temperature. The spring-loaded DCB test method has great potential for investigating the combined effects of creep, moisture, and temperature, and this study has demonstrated the validity of the test method. The long-term durability of adhesive joints becomes increasingly important, and this test method is expected to become widespread.
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spelling doaj.art-f52ead2c253f41f1823a12ca3e2a16942023-11-30T23:15:38ZengMDPI AGMaterials1996-19442023-01-0116260710.3390/ma16020607Creep Crack Growth Behavior during Hot Water Immersion of an Epoxy Adhesive Using a Spring-Loaded Double Cantilever Beam Test MethodKota Nakamura0Yu Sekiguchi1Kazumasa Shimamoto2Keiji Houjou3Haruhisa Akiyama4Chiaki Sato5Department of Mechanical Engineering, Tokyo Institute of Technology, 4259 Nagatsuta-cho, Midori-ku, Yokohama 226-8503, JapanInstitute of Innovative Research, Tokyo Institute of Technology, 4259 Nagatsuta-cho, Midori-ku, Yokohama 226-8503, JapanNanomaterials Research Institute, National Institute of Advanced Industrial Science and Technology (AIST), 1-1-1 Higashi, Tsukuba 305-8565, JapanNanomaterials Research Institute, National Institute of Advanced Industrial Science and Technology (AIST), 1-1-1 Higashi, Tsukuba 305-8565, JapanNanomaterials Research Institute, National Institute of Advanced Industrial Science and Technology (AIST), 1-1-1 Higashi, Tsukuba 305-8565, JapanInstitute of Innovative Research, Tokyo Institute of Technology, 4259 Nagatsuta-cho, Midori-ku, Yokohama 226-8503, JapanDouble cantilever beam (DCB) tests were conducted by immersing the specimens in temperature-controlled water while applying a creep load using a spring. By introducing a data reduction scheme to the spring-loaded DCB test method, it was confirmed that only a single parameter measurement was sufficient to calculate the energy release rate (ERR). Aluminum alloy substrates bonded with an epoxy adhesive were used, and DCB tests were performed by changing the initial load values, spring constants, and immersion temperatures for two types of surface treatment. The initial applied load and spring constant had no effect on the ERR threshold. In contrast, the threshold decreased with the increasing immersion temperature, but even in the worst case, it was 15% of the critical ERR in the static tests. Using the creep crack growth relationship, it was revealed that there were three phases of creep immersion crack growth in the adhesive joints, and each phase was affected by the temperature. The spring-loaded DCB test method has great potential for investigating the combined effects of creep, moisture, and temperature, and this study has demonstrated the validity of the test method. The long-term durability of adhesive joints becomes increasingly important, and this test method is expected to become widespread.https://www.mdpi.com/1996-1944/16/2/607adhesive bondinghydrothermal creepdegradationcreep fracture toughnessaging
spellingShingle Kota Nakamura
Yu Sekiguchi
Kazumasa Shimamoto
Keiji Houjou
Haruhisa Akiyama
Chiaki Sato
Creep Crack Growth Behavior during Hot Water Immersion of an Epoxy Adhesive Using a Spring-Loaded Double Cantilever Beam Test Method
Materials
adhesive bonding
hydrothermal creep
degradation
creep fracture toughness
aging
title Creep Crack Growth Behavior during Hot Water Immersion of an Epoxy Adhesive Using a Spring-Loaded Double Cantilever Beam Test Method
title_full Creep Crack Growth Behavior during Hot Water Immersion of an Epoxy Adhesive Using a Spring-Loaded Double Cantilever Beam Test Method
title_fullStr Creep Crack Growth Behavior during Hot Water Immersion of an Epoxy Adhesive Using a Spring-Loaded Double Cantilever Beam Test Method
title_full_unstemmed Creep Crack Growth Behavior during Hot Water Immersion of an Epoxy Adhesive Using a Spring-Loaded Double Cantilever Beam Test Method
title_short Creep Crack Growth Behavior during Hot Water Immersion of an Epoxy Adhesive Using a Spring-Loaded Double Cantilever Beam Test Method
title_sort creep crack growth behavior during hot water immersion of an epoxy adhesive using a spring loaded double cantilever beam test method
topic adhesive bonding
hydrothermal creep
degradation
creep fracture toughness
aging
url https://www.mdpi.com/1996-1944/16/2/607
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