Molecular Dynamics and Experimental Investigation on the Interfacial Binding Mechanism in the Fe/Cu<sub>1−x</sub>-Ni<sub>x</sub> Bimetallic Interface

Molecular Dynamics and Experimental Investigation on the Interfacial Binding Mechanism in the Fe/Cu<sub>1−x</sub>-Ni<sub>x</sub> Bimetallic Interface

To systematically investigate the diffusion behavior of Fe/Cu bimetallic materials and the influence of the Ni element on the diffusion and mechanical properties of the Fe/Cu bimetallic interface, the diffusion distance, diffusion coefficient, and strain–stress process based on molecular dynamics (M...

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Bibliographic Details
Main Authors: Guowei Zhang, Mingjie Wang, Huan Yu, Hong Xu, An Wan
Format: Article
Language:English
Published: MDPI AG 2022-09-01
Series:Nanomaterials
Subjects:
molecular dynamics
validation experiment
Ni content
Fe/Cu bimetallic interface
diffusion behavior
mechanical properties
Online Access:https://www.mdpi.com/2079-4991/12/18/3245

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