Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas

Optimal Thermal Treatment for Effective Copper Recovery in Waste Printed Circuit Boards by Physical Separation: Influence of Temperature and Gas

Printed circuit boards (PCBs) are difficult to recycle because of the layered structure of non-metal (i.e., epoxy resin, glass fiber) and copper. In this work, we conducted a systematic investigation to effectively recover copper from PCB. A thermal treatment was employed for improving the crushing...

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Bibliographic Details
Main Authors: Boram Kim, Seongsoo Han, Seungsoo Park, Seongmin Kim, Minuk Jung, Chul-Hyun Park, Ho-Seok Jeon, Dae-Weon Kim, Yosep Han
Format: Article
Language:English
Published: MDPI AG 2021-10-01
Series:Minerals
Subjects:
printed circuit boards
heat treatment
strength
liberation
Cu recovery
physical separation
Online Access:https://www.mdpi.com/2075-163X/11/11/1213

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