A Bi<sub>2</sub>Te<sub>3</sub>-Filled Nickel Foam Film with Exceptional Flexibility and Thermoelectric Performance
The past decades have witnessed surging demand for wearable electronics, for which thermoelectrics (TEs) are considered a promising self-charging technology, as they are capable of converting skin heat into electricity directly. Bi<sub>2</sub>Te<sub>3</sub> is the most-used T...
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-05-01
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| Series: | Nanomaterials |
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| Online Access: | https://www.mdpi.com/2079-4991/12/10/1693 |
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| author | Taifeng Shi Mengran Chen Zhenguo Liu Qingfeng Song Yixiang Ou Haoqi Wang Jia Liang Qihao Zhang Zhendong Mao Zhiwen Wang Jingyvan Zheng Qingchen Han Kafil M. Razeeb Peng-an Zong |
| author_facet | Taifeng Shi Mengran Chen Zhenguo Liu Qingfeng Song Yixiang Ou Haoqi Wang Jia Liang Qihao Zhang Zhendong Mao Zhiwen Wang Jingyvan Zheng Qingchen Han Kafil M. Razeeb Peng-an Zong |
| author_sort | Taifeng Shi |
| collection | DOAJ |
| description | The past decades have witnessed surging demand for wearable electronics, for which thermoelectrics (TEs) are considered a promising self-charging technology, as they are capable of converting skin heat into electricity directly. Bi<sub>2</sub>Te<sub>3</sub> is the most-used TE material at room temperature, due to a high zT of ~1. However, it is different to integrate Bi<sub>2</sub>Te<sub>3</sub> for wearable TEs owing to its intrinsic rigidity. Bi<sub>2</sub>Te<sub>3</sub> could be flexible when made thin enough, but this implies a small electrical and thermal load, thus severely restricting the power output. Herein, we developed a Bi<sub>2</sub>Te<sub>3</sub>/nickel foam (NiFoam) composite film through solvothermal deposition of Bi<sub>2</sub>Te<sub>3</sub> nanoplates into porous NiFoam. Due to the mesh structure and ductility of Ni Foam, the film, with a thickness of 160 μm, exhibited a high figure of merit for flexibility, 0.016, connoting higher output. Moreover, the film also revealed a high tensile strength of 12.7 ± 0.04 MPa and a maximum elongation rate of 28.8%. In addition, due to the film’s high electrical conductivity and enhanced Seebeck coefficient, an outstanding power factor of 850 μW m<sup>−1</sup> K<sup>−2</sup> was achieved, which is among the highest ever reported. A module fabricated with five such n-type legs integrated electrically in series and thermally in parallel showed an output power of 22.8 nW at a temperature gap of 30 K. This work offered a cost-effective avenue for making highly flexible TE films for power supply of wearable electronics by intercalating TE nanoplates into porous and meshed-structure materials. |
| first_indexed | 2024-03-10T03:16:48Z |
| format | Article |
| id | doaj.art-f622d80886854e18a887e11ceeb8d96a |
| institution | Directory Open Access Journal |
| issn | 2079-4991 |
| language | English |
| last_indexed | 2024-03-10T03:16:48Z |
| publishDate | 2022-05-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Nanomaterials |
| spelling | doaj.art-f622d80886854e18a887e11ceeb8d96a2023-11-23T12:26:42ZengMDPI AGNanomaterials2079-49912022-05-011210169310.3390/nano12101693A Bi<sub>2</sub>Te<sub>3</sub>-Filled Nickel Foam Film with Exceptional Flexibility and Thermoelectric PerformanceTaifeng Shi0Mengran Chen1Zhenguo Liu2Qingfeng Song3Yixiang Ou4Haoqi Wang5Jia Liang6Qihao Zhang7Zhendong Mao8Zhiwen Wang9Jingyvan Zheng10Qingchen Han11Kafil M. Razeeb12Peng-an Zong13College of Materials Science and Engineering, Nanjing Tech University, Nanjing 210009, ChinaCollege of Materials Science and Engineering, Nanjing Tech University, Nanjing 210009, ChinaKey Laboratory of Flexible Electronics of Zhejiang Province, Ningbo Institute of Northwestern Polytechnical University, Ningbo 315103, ChinaState Key Laboratory of High-Performance Ceramics and Superfine Microstructures, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, ChinaRadiation Technology Institute, Beijing Academy of Science and Technology, Beijing 100875, ChinaKey Laboratory of Beam Technology of Ministry of Education, College of Nuclear Science and Technology, Beijing Normal University, Beijing 100875, ChinaState Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, ChinaInstitute for Metallic Materials, Leibniz Institute for Solid State and Materials Research, 01069 Dresden, GermanyCollege of Materials Science and Engineering, Nanjing Tech University, Nanjing 210009, ChinaCollege of Materials Science and Engineering, Nanjing Tech University, Nanjing 210009, ChinaCollege of Materials Science and Engineering, Nanjing Tech University, Nanjing 210009, ChinaCollege of Materials Science and Engineering, Nanjing Tech University, Nanjing 210009, ChinaMicro-Nano Systems Centre, Tyndall National Institute, University College Cork, Dyke Parade, Lee Maltings, T12 R5CP Cork, IrelandCollege of Materials Science and Engineering, Nanjing Tech University, Nanjing 210009, ChinaThe past decades have witnessed surging demand for wearable electronics, for which thermoelectrics (TEs) are considered a promising self-charging technology, as they are capable of converting skin heat into electricity directly. Bi<sub>2</sub>Te<sub>3</sub> is the most-used TE material at room temperature, due to a high zT of ~1. However, it is different to integrate Bi<sub>2</sub>Te<sub>3</sub> for wearable TEs owing to its intrinsic rigidity. Bi<sub>2</sub>Te<sub>3</sub> could be flexible when made thin enough, but this implies a small electrical and thermal load, thus severely restricting the power output. Herein, we developed a Bi<sub>2</sub>Te<sub>3</sub>/nickel foam (NiFoam) composite film through solvothermal deposition of Bi<sub>2</sub>Te<sub>3</sub> nanoplates into porous NiFoam. Due to the mesh structure and ductility of Ni Foam, the film, with a thickness of 160 μm, exhibited a high figure of merit for flexibility, 0.016, connoting higher output. Moreover, the film also revealed a high tensile strength of 12.7 ± 0.04 MPa and a maximum elongation rate of 28.8%. In addition, due to the film’s high electrical conductivity and enhanced Seebeck coefficient, an outstanding power factor of 850 μW m<sup>−1</sup> K<sup>−2</sup> was achieved, which is among the highest ever reported. A module fabricated with five such n-type legs integrated electrically in series and thermally in parallel showed an output power of 22.8 nW at a temperature gap of 30 K. This work offered a cost-effective avenue for making highly flexible TE films for power supply of wearable electronics by intercalating TE nanoplates into porous and meshed-structure materials.https://www.mdpi.com/2079-4991/12/10/1693Bi<sub>2</sub>Te<sub>3</sub>nickel foamsolvothermal methodthermoelectric filmflexibleTEG |
| spellingShingle | Taifeng Shi Mengran Chen Zhenguo Liu Qingfeng Song Yixiang Ou Haoqi Wang Jia Liang Qihao Zhang Zhendong Mao Zhiwen Wang Jingyvan Zheng Qingchen Han Kafil M. Razeeb Peng-an Zong A Bi<sub>2</sub>Te<sub>3</sub>-Filled Nickel Foam Film with Exceptional Flexibility and Thermoelectric Performance Nanomaterials Bi<sub>2</sub>Te<sub>3</sub> nickel foam solvothermal method thermoelectric film flexible TEG |
| title | A Bi<sub>2</sub>Te<sub>3</sub>-Filled Nickel Foam Film with Exceptional Flexibility and Thermoelectric Performance |
| title_full | A Bi<sub>2</sub>Te<sub>3</sub>-Filled Nickel Foam Film with Exceptional Flexibility and Thermoelectric Performance |
| title_fullStr | A Bi<sub>2</sub>Te<sub>3</sub>-Filled Nickel Foam Film with Exceptional Flexibility and Thermoelectric Performance |
| title_full_unstemmed | A Bi<sub>2</sub>Te<sub>3</sub>-Filled Nickel Foam Film with Exceptional Flexibility and Thermoelectric Performance |
| title_short | A Bi<sub>2</sub>Te<sub>3</sub>-Filled Nickel Foam Film with Exceptional Flexibility and Thermoelectric Performance |
| title_sort | bi sub 2 sub te sub 3 sub filled nickel foam film with exceptional flexibility and thermoelectric performance |
| topic | Bi<sub>2</sub>Te<sub>3</sub> nickel foam solvothermal method thermoelectric film flexible TEG |
| url | https://www.mdpi.com/2079-4991/12/10/1693 |
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