Stier, S. P., & Böse, H. (2020). Ablative Laser Structuring for Stretchable Multilayer and Multi-Material Electronics and Sensor Systems. MDPI AG.
Chicago Style (17th ed.) CitationStier, Simon P., and Holger Böse. Ablative Laser Structuring for Stretchable Multilayer and Multi-Material Electronics and Sensor Systems. MDPI AG, 2020.
MLA (9th ed.) CitationStier, Simon P., and Holger Böse. Ablative Laser Structuring for Stretchable Multilayer and Multi-Material Electronics and Sensor Systems. MDPI AG, 2020.
Warning: These citations may not always be 100% accurate.