Orthogonal Experimental Research on Dielectrophoresis Polishing (DEPP) of Silicon Wafer

Orthogonal Experimental Research on Dielectrophoresis Polishing (DEPP) of Silicon Wafer

Silicon wafer with high surface quality is widely used as substrate materials in the fields of micromachines and microelectronics, so a high-efficiency and high-quality polishing method is urgently needed to meet its large demand. In this paper, a dielectrophoresis polishing (DEPP) method was propos...

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Bibliographic Details
Main Authors: Tianchen Zhao, Qianfa Deng, Cheng Zhang, Kaiping Feng, Zhaozhong Zhou, Julong Yuan
Format: Article
Language:English
Published: MDPI AG 2020-05-01
Series:Micromachines
Subjects:
silicon wafer
dielectrophoresis polishing
orthogonal experiment
material removal rate
surface roughness
Online Access:https://www.mdpi.com/2072-666X/11/6/544

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