Fabrication of a capacitive relative humidity sensor using aluminum thin films deposited on etched printed circuit board

A capacitive humidity-sensing device was created by thermal evaporation of 99.999% aluminum. The substrate used for the coating was etched double-sided printed circuit board. The etched printed circuit board serves as the dielectric of the capacitor while the aluminum thin films deposited on either...

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Main Authors: Lee Jacqueline Ann L., Culaba Ivan B.
Format: Article
Language:English
Published: EDP Sciences 2016-01-01
Series:MATEC Web of Conferences
Online Access:http://dx.doi.org/10.1051/matecconf/20165901011
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author Lee Jacqueline Ann L.
Culaba Ivan B.
author_facet Lee Jacqueline Ann L.
Culaba Ivan B.
author_sort Lee Jacqueline Ann L.
collection DOAJ
description A capacitive humidity-sensing device was created by thermal evaporation of 99.999% aluminum. The substrate used for the coating was etched double-sided printed circuit board. The etched printed circuit board serves as the dielectric of the capacitor while the aluminum thin films deposited on either side serve as the plates of the capacitor. The capacitance was measured before and after exposure to humidity. The device was then calibrated by comparing the readings of capacitance with that of the relative humidity sensor of the Vernier LabQuest2. It was found that there is a linear relationship between the capacitance and relative humidity given by the equation C=1.418RH+29.139 where C is the capacitance and RH is the relative humidity. The surface of the aluminum films is porous and it is through these pores that water is adsorbed and capillary condensation occurs, thereby causing the capacitance to change upon exposure to humidity.
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spelling doaj.art-f7d8162018e548c6b036a32bcd0bdc872022-12-21T23:27:58ZengEDP SciencesMATEC Web of Conferences2261-236X2016-01-01590101110.1051/matecconf/20165901011matecconf_icfst2016_01011Fabrication of a capacitive relative humidity sensor using aluminum thin films deposited on etched printed circuit boardLee Jacqueline Ann L.Culaba Ivan B.A capacitive humidity-sensing device was created by thermal evaporation of 99.999% aluminum. The substrate used for the coating was etched double-sided printed circuit board. The etched printed circuit board serves as the dielectric of the capacitor while the aluminum thin films deposited on either side serve as the plates of the capacitor. The capacitance was measured before and after exposure to humidity. The device was then calibrated by comparing the readings of capacitance with that of the relative humidity sensor of the Vernier LabQuest2. It was found that there is a linear relationship between the capacitance and relative humidity given by the equation C=1.418RH+29.139 where C is the capacitance and RH is the relative humidity. The surface of the aluminum films is porous and it is through these pores that water is adsorbed and capillary condensation occurs, thereby causing the capacitance to change upon exposure to humidity.http://dx.doi.org/10.1051/matecconf/20165901011
spellingShingle Lee Jacqueline Ann L.
Culaba Ivan B.
Fabrication of a capacitive relative humidity sensor using aluminum thin films deposited on etched printed circuit board
MATEC Web of Conferences
title Fabrication of a capacitive relative humidity sensor using aluminum thin films deposited on etched printed circuit board
title_full Fabrication of a capacitive relative humidity sensor using aluminum thin films deposited on etched printed circuit board
title_fullStr Fabrication of a capacitive relative humidity sensor using aluminum thin films deposited on etched printed circuit board
title_full_unstemmed Fabrication of a capacitive relative humidity sensor using aluminum thin films deposited on etched printed circuit board
title_short Fabrication of a capacitive relative humidity sensor using aluminum thin films deposited on etched printed circuit board
title_sort fabrication of a capacitive relative humidity sensor using aluminum thin films deposited on etched printed circuit board
url http://dx.doi.org/10.1051/matecconf/20165901011
work_keys_str_mv AT leejacquelineannl fabricationofacapacitiverelativehumiditysensorusingaluminumthinfilmsdepositedonetchedprintedcircuitboard
AT culabaivanb fabricationofacapacitiverelativehumiditysensorusingaluminumthinfilmsdepositedonetchedprintedcircuitboard