Development of technology for deposition of thick copper layers onto ceramic substrates applied in power electronics
The basic element of the design of a power module is a metallized ceramic substrate. In this work, the formation of metallization coatings by the method of thermal transfer of metallization pastes (Mo-Mn-Si + binder) for alumina and aluminum nitride ceramics was carried out. The fixing of the metall...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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Uralʹskij federalʹnyj universitet imeni pervogo Prezidenta Rossii B.N. Elʹcina
2022-07-01
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| Series: | Chimica Techno Acta |
| Subjects: | |
| Online Access: | https://journals.urfu.ru/index.php/chimtech/article/view/5990 |
| _version_ | 1811183192179212288 |
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| author | Yuri K. Nepochatov Pyotr M. Pletnev Vladimir F. Kosarev Tatiana S. Gudyma |
| author_facet | Yuri K. Nepochatov Pyotr M. Pletnev Vladimir F. Kosarev Tatiana S. Gudyma |
| author_sort | Yuri K. Nepochatov |
| collection | DOAJ |
| description | The basic element of the design of a power module is a metallized ceramic substrate. In this work, the formation of metallization coatings by the method of thermal transfer of metallization pastes (Mo-Mn-Si + binder) for alumina and aluminum nitride ceramics was carried out. The fixing of the metallization coating on the ceramic substrate was performed by firing at a temperature of 1320 °C. The subsequent deposition of the copper layer was carried out by the method of cold gas-dynamic spraying (CGDS) followed by annealing of the deposited coating. For high-quality adhesion, the optimum annealing temperature was 1000 °C. |
| first_indexed | 2024-04-11T09:42:39Z |
| format | Article |
| id | doaj.art-f8cd33cbfd1b4e94a5332032d0a82933 |
| institution | Directory Open Access Journal |
| issn | 2411-1414 |
| language | English |
| last_indexed | 2024-04-11T09:42:39Z |
| publishDate | 2022-07-01 |
| publisher | Uralʹskij federalʹnyj universitet imeni pervogo Prezidenta Rossii B.N. Elʹcina |
| record_format | Article |
| series | Chimica Techno Acta |
| spelling | doaj.art-f8cd33cbfd1b4e94a5332032d0a829332022-12-22T04:31:09ZengUralʹskij federalʹnyj universitet imeni pervogo Prezidenta Rossii B.N. ElʹcinaChimica Techno Acta2411-14142022-07-019310.15826/chimtech.2022.9.3.074519Development of technology for deposition of thick copper layers onto ceramic substrates applied in power electronicsYuri K. Nepochatov0Pyotr M. Pletnev1Vladimir F. Kosarev2Tatiana S. Gudyma3HC PJSC NEVZ–SoyuzSiberian State Transport UniversityInstitute of Theoretical and Applied Mechanics SB RASNovosibirsk State Technical UniversityThe basic element of the design of a power module is a metallized ceramic substrate. In this work, the formation of metallization coatings by the method of thermal transfer of metallization pastes (Mo-Mn-Si + binder) for alumina and aluminum nitride ceramics was carried out. The fixing of the metallization coating on the ceramic substrate was performed by firing at a temperature of 1320 °C. The subsequent deposition of the copper layer was carried out by the method of cold gas-dynamic spraying (CGDS) followed by annealing of the deposited coating. For high-quality adhesion, the optimum annealing temperature was 1000 °C.https://journals.urfu.ru/index.php/chimtech/article/view/5990ceramicsmetallization coatingaluminum nitridecopperadhesion |
| spellingShingle | Yuri K. Nepochatov Pyotr M. Pletnev Vladimir F. Kosarev Tatiana S. Gudyma Development of technology for deposition of thick copper layers onto ceramic substrates applied in power electronics Chimica Techno Acta ceramics metallization coating aluminum nitride copper adhesion |
| title | Development of technology for deposition of thick copper layers onto ceramic substrates applied in power electronics |
| title_full | Development of technology for deposition of thick copper layers onto ceramic substrates applied in power electronics |
| title_fullStr | Development of technology for deposition of thick copper layers onto ceramic substrates applied in power electronics |
| title_full_unstemmed | Development of technology for deposition of thick copper layers onto ceramic substrates applied in power electronics |
| title_short | Development of technology for deposition of thick copper layers onto ceramic substrates applied in power electronics |
| title_sort | development of technology for deposition of thick copper layers onto ceramic substrates applied in power electronics |
| topic | ceramics metallization coating aluminum nitride copper adhesion |
| url | https://journals.urfu.ru/index.php/chimtech/article/view/5990 |
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