Development of technology for deposition of thick copper layers onto ceramic substrates applied in power electronics

Development of technology for deposition of thick copper layers onto ceramic substrates applied in power electronics

The basic element of the design of a power module is a metallized ceramic substrate. In this work, the formation of metallization coatings by the method of thermal transfer of metallization pastes (Mo-Mn-Si + binder) for alumina and aluminum nitride ceramics was carried out. The fixing of the metall...

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Bibliographic Details
Main Authors: Yuri K. Nepochatov, Pyotr M. Pletnev, Vladimir F. Kosarev, Tatiana S. Gudyma
Format: Article
Language:English
Published: Uralʹskij federalʹnyj universitet imeni pervogo Prezidenta Rossii B.N. Elʹcina 2022-07-01
Series:Chimica Techno Acta
Subjects:
ceramics
metallization coating
aluminum nitride
copper
adhesion
Online Access:https://journals.urfu.ru/index.php/chimtech/article/view/5990

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