Graphitized-rGO/Polyimide Aerogel as the Compressible Thermal Interface Material with Both High in-Plane and through-Plane Thermal Conductivities
Reduced graphene oxide (rGO) aerogels with a three-dimensional (3D) interconnected network provides continuous heat transport paths in multi-directions. However, the high porosity of rGO aerogels commonly leads to very low thermal conductivity (TC), and defects and grain boundaries of rGO sheets res...
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MDPI AG
2021-04-01
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author | Peng Lv Haiquan Cheng Chenglong Ji Wei Wei |
author_facet | Peng Lv Haiquan Cheng Chenglong Ji Wei Wei |
author_sort | Peng Lv |
collection | DOAJ |
description | Reduced graphene oxide (rGO) aerogels with a three-dimensional (3D) interconnected network provides continuous heat transport paths in multi-directions. However, the high porosity of rGO aerogels commonly leads to very low thermal conductivity (TC), and defects and grain boundaries of rGO sheets result in a high extent of phonon scattering, which is far from satisfying the requirement of thermal interface materials (TIMs). Here, a compressible graphitized-rGO/polyimide (g-rGO/PI) aerogel was prepared by the ice-template method and “molecular welding” strategy. The regular cellular structure and closely packed cell walls bring the g-rGO/PI aerogel high compressibility, which made the aerogel can maintain the continuous thermal transport paths well even in highly compacted status. The rGO sheets in the cell wall surface are welded up by g-PI during imidization and graphitization treatment, providing efficient channels for phonon transportation in the 3D network. The g-rGO/PI aerogel in a compressive strain of 95% has a high TC in the plane of 172.5 W m<sup>−1</sup>k<sup>−1</sup> and a high TC through the plane of 58.1 W m<sup>−1</sup>k<sup>−1</sup>, which is superior to other carbon-based TIMs previously reported. |
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language | English |
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spelling | doaj.art-f96fd5101d3e4d40b3fc9980c5e3f98c2023-11-21T18:03:08ZengMDPI AGMaterials1996-19442021-04-01149235010.3390/ma14092350Graphitized-rGO/Polyimide Aerogel as the Compressible Thermal Interface Material with Both High in-Plane and through-Plane Thermal ConductivitiesPeng Lv0Haiquan Cheng1Chenglong Ji2Wei Wei3Department of Optoelectronic Information Science and Engineering, College of Electronic and Opitical Engineering, Nanjing University of Posts & Telecommunications, Nanjing 210023, ChinaDepartment of Optoelectronic Information Science and Engineering, College of Electronic and Opitical Engineering, Nanjing University of Posts & Telecommunications, Nanjing 210023, ChinaDepartment of Optoelectronic Information Science and Engineering, College of Electronic and Opitical Engineering, Nanjing University of Posts & Telecommunications, Nanjing 210023, ChinaDepartment of Optoelectronic Information Science and Engineering, College of Electronic and Opitical Engineering, Nanjing University of Posts & Telecommunications, Nanjing 210023, ChinaReduced graphene oxide (rGO) aerogels with a three-dimensional (3D) interconnected network provides continuous heat transport paths in multi-directions. However, the high porosity of rGO aerogels commonly leads to very low thermal conductivity (TC), and defects and grain boundaries of rGO sheets result in a high extent of phonon scattering, which is far from satisfying the requirement of thermal interface materials (TIMs). Here, a compressible graphitized-rGO/polyimide (g-rGO/PI) aerogel was prepared by the ice-template method and “molecular welding” strategy. The regular cellular structure and closely packed cell walls bring the g-rGO/PI aerogel high compressibility, which made the aerogel can maintain the continuous thermal transport paths well even in highly compacted status. The rGO sheets in the cell wall surface are welded up by g-PI during imidization and graphitization treatment, providing efficient channels for phonon transportation in the 3D network. The g-rGO/PI aerogel in a compressive strain of 95% has a high TC in the plane of 172.5 W m<sup>−1</sup>k<sup>−1</sup> and a high TC through the plane of 58.1 W m<sup>−1</sup>k<sup>−1</sup>, which is superior to other carbon-based TIMs previously reported.https://www.mdpi.com/1996-1944/14/9/2350thermal interface materialsreduced graphene oxidepolyimidecompressibilitythermal conductivity |
spellingShingle | Peng Lv Haiquan Cheng Chenglong Ji Wei Wei Graphitized-rGO/Polyimide Aerogel as the Compressible Thermal Interface Material with Both High in-Plane and through-Plane Thermal Conductivities Materials thermal interface materials reduced graphene oxide polyimide compressibility thermal conductivity |
title | Graphitized-rGO/Polyimide Aerogel as the Compressible Thermal Interface Material with Both High in-Plane and through-Plane Thermal Conductivities |
title_full | Graphitized-rGO/Polyimide Aerogel as the Compressible Thermal Interface Material with Both High in-Plane and through-Plane Thermal Conductivities |
title_fullStr | Graphitized-rGO/Polyimide Aerogel as the Compressible Thermal Interface Material with Both High in-Plane and through-Plane Thermal Conductivities |
title_full_unstemmed | Graphitized-rGO/Polyimide Aerogel as the Compressible Thermal Interface Material with Both High in-Plane and through-Plane Thermal Conductivities |
title_short | Graphitized-rGO/Polyimide Aerogel as the Compressible Thermal Interface Material with Both High in-Plane and through-Plane Thermal Conductivities |
title_sort | graphitized rgo polyimide aerogel as the compressible thermal interface material with both high in plane and through plane thermal conductivities |
topic | thermal interface materials reduced graphene oxide polyimide compressibility thermal conductivity |
url | https://www.mdpi.com/1996-1944/14/9/2350 |
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