Shock and impact reliability of electronic assemblies with perimeter vs full array layouts: A numerical comparative study
This study aims to assess the effect of the solder joint array layouts, including full and peripheral designs, on the mechanical response and reliability of electronic packages subjected to shock and impact loadings. Linear and nonlinear finite element simulations using the global-local modeling tec...
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| Format: | Article |
| Language: | English |
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De Gruyter
2022-07-01
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| Series: | Journal of the Mechanical Behavior of Materials |
| Subjects: | |
| Online Access: | https://doi.org/10.1515/jmbm-2022-0058 |
| _version_ | 1811236515363160064 |
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| author | Gharaibeh Mohammad A. |
| author_facet | Gharaibeh Mohammad A. |
| author_sort | Gharaibeh Mohammad A. |
| collection | DOAJ |
| description | This study aims to assess the effect of the solder joint array layouts, including full and peripheral designs, on the mechanical response and reliability of electronic packages subjected to shock and impact loadings. Linear and nonlinear finite element simulations using the global-local modeling technique are employed to perform the analysis. Several peripheral array configurations are considered and compared to the full array systems. The results showed that, for optimum electronic package designs in terms of reliability and cost, it is highly recommended to use peripheral packages having three or four rows of solder interconnects in electronic systems under shock and impact loadings. |
| first_indexed | 2024-04-12T12:10:50Z |
| format | Article |
| id | doaj.art-fa046c9382eb492c9d6fd0b463ed815a |
| institution | Directory Open Access Journal |
| issn | 2191-0243 |
| language | English |
| last_indexed | 2024-04-12T12:10:50Z |
| publishDate | 2022-07-01 |
| publisher | De Gruyter |
| record_format | Article |
| series | Journal of the Mechanical Behavior of Materials |
| spelling | doaj.art-fa046c9382eb492c9d6fd0b463ed815a2022-12-22T03:33:36ZengDe GruyterJournal of the Mechanical Behavior of Materials2191-02432022-07-0131153554510.1515/jmbm-2022-0058Shock and impact reliability of electronic assemblies with perimeter vs full array layouts: A numerical comparative studyGharaibeh Mohammad A.0Department of Mechanical Engineering, Faculty of Engineering, Hashemite University, Zarqa, 13133, JordanThis study aims to assess the effect of the solder joint array layouts, including full and peripheral designs, on the mechanical response and reliability of electronic packages subjected to shock and impact loadings. Linear and nonlinear finite element simulations using the global-local modeling technique are employed to perform the analysis. Several peripheral array configurations are considered and compared to the full array systems. The results showed that, for optimum electronic package designs in terms of reliability and cost, it is highly recommended to use peripheral packages having three or four rows of solder interconnects in electronic systems under shock and impact loadings.https://doi.org/10.1515/jmbm-2022-0058electronic packagingreliabilityperipheral and full arraysshock and impact |
| spellingShingle | Gharaibeh Mohammad A. Shock and impact reliability of electronic assemblies with perimeter vs full array layouts: A numerical comparative study Journal of the Mechanical Behavior of Materials electronic packaging reliability peripheral and full arrays shock and impact |
| title | Shock and impact reliability of electronic assemblies with perimeter vs full array layouts: A numerical comparative study |
| title_full | Shock and impact reliability of electronic assemblies with perimeter vs full array layouts: A numerical comparative study |
| title_fullStr | Shock and impact reliability of electronic assemblies with perimeter vs full array layouts: A numerical comparative study |
| title_full_unstemmed | Shock and impact reliability of electronic assemblies with perimeter vs full array layouts: A numerical comparative study |
| title_short | Shock and impact reliability of electronic assemblies with perimeter vs full array layouts: A numerical comparative study |
| title_sort | shock and impact reliability of electronic assemblies with perimeter vs full array layouts a numerical comparative study |
| topic | electronic packaging reliability peripheral and full arrays shock and impact |
| url | https://doi.org/10.1515/jmbm-2022-0058 |
| work_keys_str_mv | AT gharaibehmohammada shockandimpactreliabilityofelectronicassemblieswithperimetervsfullarraylayoutsanumericalcomparativestudy |