Shock and impact reliability of electronic assemblies with perimeter vs full array layouts: A numerical comparative study
This study aims to assess the effect of the solder joint array layouts, including full and peripheral designs, on the mechanical response and reliability of electronic packages subjected to shock and impact loadings. Linear and nonlinear finite element simulations using the global-local modeling tec...
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| Format: | Article |
| Language: | English |
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De Gruyter
2022-07-01
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| Series: | Journal of the Mechanical Behavior of Materials |
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| Online Access: | https://doi.org/10.1515/jmbm-2022-0058 |