Recent Advances in Thermoplastic Microfluidic Bonding
Microfluidics is a multidisciplinary technology with applications in various fields, such as biomedical, energy, chemicals and environment. Thermoplastic is one of the most prominent materials for polymer microfluidics. Properties such as good mechanical rigidity, organic solvent resistivity, acid/b...
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-03-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/13/3/486 |
| _version_ | 1827627577522520064 |
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| author | Kiran Giri Chia-Wen Tsao |
| author_facet | Kiran Giri Chia-Wen Tsao |
| author_sort | Kiran Giri |
| collection | DOAJ |
| description | Microfluidics is a multidisciplinary technology with applications in various fields, such as biomedical, energy, chemicals and environment. Thermoplastic is one of the most prominent materials for polymer microfluidics. Properties such as good mechanical rigidity, organic solvent resistivity, acid/base resistivity, and low water absorbance make thermoplastics suitable for various microfluidic applications. However, bonding of thermoplastics has always been challenging because of a wide range of bonding methods and requirements. This review paper summarizes the current bonding processes being practiced for the fabrication of thermoplastic microfluidic devices, and provides a comparison between the different bonding strategies to assist researchers in finding appropriate bonding methods for microfluidic device assembly. |
| first_indexed | 2024-03-09T13:17:02Z |
| format | Article |
| id | doaj.art-fafdad8073174cb3b6fa25b489437119 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-09T13:17:02Z |
| publishDate | 2022-03-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-fafdad8073174cb3b6fa25b4894371192023-11-30T21:34:51ZengMDPI AGMicromachines2072-666X2022-03-0113348610.3390/mi13030486Recent Advances in Thermoplastic Microfluidic BondingKiran Giri0Chia-Wen Tsao1Department of Mechanical Engineering, National Central University, Taoyuan City 320, TaiwanDepartment of Mechanical Engineering, National Central University, Taoyuan City 320, TaiwanMicrofluidics is a multidisciplinary technology with applications in various fields, such as biomedical, energy, chemicals and environment. Thermoplastic is one of the most prominent materials for polymer microfluidics. Properties such as good mechanical rigidity, organic solvent resistivity, acid/base resistivity, and low water absorbance make thermoplastics suitable for various microfluidic applications. However, bonding of thermoplastics has always been challenging because of a wide range of bonding methods and requirements. This review paper summarizes the current bonding processes being practiced for the fabrication of thermoplastic microfluidic devices, and provides a comparison between the different bonding strategies to assist researchers in finding appropriate bonding methods for microfluidic device assembly.https://www.mdpi.com/2072-666X/13/3/486microfluidic chip fabricationmicrofluidic bondingthermoplastic bondingpolymer microfabrication |
| spellingShingle | Kiran Giri Chia-Wen Tsao Recent Advances in Thermoplastic Microfluidic Bonding Micromachines microfluidic chip fabrication microfluidic bonding thermoplastic bonding polymer microfabrication |
| title | Recent Advances in Thermoplastic Microfluidic Bonding |
| title_full | Recent Advances in Thermoplastic Microfluidic Bonding |
| title_fullStr | Recent Advances in Thermoplastic Microfluidic Bonding |
| title_full_unstemmed | Recent Advances in Thermoplastic Microfluidic Bonding |
| title_short | Recent Advances in Thermoplastic Microfluidic Bonding |
| title_sort | recent advances in thermoplastic microfluidic bonding |
| topic | microfluidic chip fabrication microfluidic bonding thermoplastic bonding polymer microfabrication |
| url | https://www.mdpi.com/2072-666X/13/3/486 |
| work_keys_str_mv | AT kirangiri recentadvancesinthermoplasticmicrofluidicbonding AT chiawentsao recentadvancesinthermoplasticmicrofluidicbonding |