Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array
In this research, an efficient thermal-stress coupling design method for a Chiplet-based system with a coaxial through silicon via (CTSV) array is developed by combining the support vector machine (SVM) model and particle swarm optimization algorithm with linear decreasing inertia weight (PSO-LDIW)....
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-07-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/14/8/1493 |
| _version_ | 1797583869975724032 |
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| author | Xianglong Wang Jiaming Su Dongdong Chen Di Li Gaoliang Li Yintang Yang |
| author_facet | Xianglong Wang Jiaming Su Dongdong Chen Di Li Gaoliang Li Yintang Yang |
| author_sort | Xianglong Wang |
| collection | DOAJ |
| description | In this research, an efficient thermal-stress coupling design method for a Chiplet-based system with a coaxial through silicon via (CTSV) array is developed by combining the support vector machine (SVM) model and particle swarm optimization algorithm with linear decreasing inertia weight (PSO-LDIW). The complex and irregular relationship between the structural parameters and critical indexes is analyzed by finite element simulation. According to the simulation data, the SVM model is adopted to characterize the relationship between structural parameters and critical indexes of the CTSV array. Based on the desired critical indexes of the CTSV array, the multi-objective evaluation function is established. Afterwards, the structural parameters of the CTSV array are optimized through the PSO-LDIW algorithm. Finally, the effectiveness of the developed method is verified by the finite element simulation. The simulated peak temperature, peak stress of the Chiplet-based system, and peak stress of the copper column (306.16 K, 28.48 MPa, and 25.76 MPa) well agree with the desired targets (310 K, 30 MPa, and 25 MPa). Therefore, the developed thermal-stress coupling design method can effectively design CTSV arrays for manufacturing high-performance interconnect structures applied in Chiplet-based systems. |
| first_indexed | 2024-03-10T23:44:11Z |
| format | Article |
| id | doaj.art-fbc28bbec9594761a60d954b74df02b4 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-10T23:44:11Z |
| publishDate | 2023-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-fbc28bbec9594761a60d954b74df02b42023-11-19T02:12:22ZengMDPI AGMicromachines2072-666X2023-07-01148149310.3390/mi14081493Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV ArrayXianglong Wang0Jiaming Su1Dongdong Chen2Di Li3Gaoliang Li4Yintang Yang5School of Microelectronics, Xidian University, Xi’an 710071, ChinaSchool of Microelectronics, Xidian University, Xi’an 710071, ChinaSchool of Microelectronics, Xidian University, Xi’an 710071, ChinaSchool of Microelectronics, Xidian University, Xi’an 710071, ChinaCCTEG Ecological Environment Technology Co., Ltd., Beijing 100013, ChinaSchool of Microelectronics, Xidian University, Xi’an 710071, ChinaIn this research, an efficient thermal-stress coupling design method for a Chiplet-based system with a coaxial through silicon via (CTSV) array is developed by combining the support vector machine (SVM) model and particle swarm optimization algorithm with linear decreasing inertia weight (PSO-LDIW). The complex and irregular relationship between the structural parameters and critical indexes is analyzed by finite element simulation. According to the simulation data, the SVM model is adopted to characterize the relationship between structural parameters and critical indexes of the CTSV array. Based on the desired critical indexes of the CTSV array, the multi-objective evaluation function is established. Afterwards, the structural parameters of the CTSV array are optimized through the PSO-LDIW algorithm. Finally, the effectiveness of the developed method is verified by the finite element simulation. The simulated peak temperature, peak stress of the Chiplet-based system, and peak stress of the copper column (306.16 K, 28.48 MPa, and 25.76 MPa) well agree with the desired targets (310 K, 30 MPa, and 25 MPa). Therefore, the developed thermal-stress coupling design method can effectively design CTSV arrays for manufacturing high-performance interconnect structures applied in Chiplet-based systems.https://www.mdpi.com/2072-666X/14/8/1493coaxial through silicon viaChiplet-based systeminterconnect structurethermal-stress coupling |
| spellingShingle | Xianglong Wang Jiaming Su Dongdong Chen Di Li Gaoliang Li Yintang Yang Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array Micromachines coaxial through silicon via Chiplet-based system interconnect structure thermal-stress coupling |
| title | Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array |
| title_full | Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array |
| title_fullStr | Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array |
| title_full_unstemmed | Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array |
| title_short | Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array |
| title_sort | efficient thermal stress coupling design of chiplet based system with coaxial tsv array |
| topic | coaxial through silicon via Chiplet-based system interconnect structure thermal-stress coupling |
| url | https://www.mdpi.com/2072-666X/14/8/1493 |
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