Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array

Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array

In this research, an efficient thermal-stress coupling design method for a Chiplet-based system with a coaxial through silicon via (CTSV) array is developed by combining the support vector machine (SVM) model and particle swarm optimization algorithm with linear decreasing inertia weight (PSO-LDIW)....

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Bibliographic Details
Main Authors: Xianglong Wang, Jiaming Su, Dongdong Chen, Di Li, Gaoliang Li, Yintang Yang
Format: Article
Language:English
Published: MDPI AG 2023-07-01
Series:Micromachines
Subjects:
coaxial through silicon via
Chiplet-based system
interconnect structure
thermal-stress coupling
Online Access:https://www.mdpi.com/2072-666X/14/8/1493

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