Optimization of Trepanning Patterns for Holes Ablated Using Nanosecond Pulse Laser in Al<sub>2</sub>O<sub>3</sub> Ceramics Substrate

Trepanning pattern is an important factor in laser hole machining, affecting both the hole quality and process efficiency. The influence of laser trepanning patterns on the hole ablating using nanosecond pulse laser in Al<sub>2</sub>O<sub>3</sub> ceramics substrate was studie...

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Main Authors: Wanqin Zhao, Xuesong Mei
Format: Article
Language:English
Published: MDPI AG 2021-07-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/14/14/3834
_version_ 1797526760903933952
author Wanqin Zhao
Xuesong Mei
author_facet Wanqin Zhao
Xuesong Mei
author_sort Wanqin Zhao
collection DOAJ
description Trepanning pattern is an important factor in laser hole machining, affecting both the hole quality and process efficiency. The influence of laser trepanning patterns on the hole ablating using nanosecond pulse laser in Al<sub>2</sub>O<sub>3</sub> ceramics substrate was studied. Two laser trepanning patterns were evaluated, filled spiral trepanning and multiple rings trepanning, with the optimized laser machining parameters. In conjunction with the studies, the hole saturated taper and the saturated processing time were taken as the primary criteria for evaluation of the hole quality and the machining efficiency, respectively. Finally, the trepanning patterns were optimized aiming for the high hole quality; the process was based on the saturated hole tapers. The hole high qualities and machining efficiencies were obtained based on the saturated processing time, which was proven to have a great significance when using the nanosecond pulse laser to machine Al<sub>2</sub>O<sub>3</sub> ceramics substrate.
first_indexed 2024-03-10T09:33:57Z
format Article
id doaj.art-fc01d0cf510848cca57d17522e7f40cb
institution Directory Open Access Journal
issn 1996-1944
language English
last_indexed 2024-03-10T09:33:57Z
publishDate 2021-07-01
publisher MDPI AG
record_format Article
series Materials
spelling doaj.art-fc01d0cf510848cca57d17522e7f40cb2023-11-22T04:15:29ZengMDPI AGMaterials1996-19442021-07-011414383410.3390/ma14143834Optimization of Trepanning Patterns for Holes Ablated Using Nanosecond Pulse Laser in Al<sub>2</sub>O<sub>3</sub> Ceramics SubstrateWanqin Zhao0Xuesong Mei1State Key Laboratory for Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, ChinaState Key Laboratory for Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, ChinaTrepanning pattern is an important factor in laser hole machining, affecting both the hole quality and process efficiency. The influence of laser trepanning patterns on the hole ablating using nanosecond pulse laser in Al<sub>2</sub>O<sub>3</sub> ceramics substrate was studied. Two laser trepanning patterns were evaluated, filled spiral trepanning and multiple rings trepanning, with the optimized laser machining parameters. In conjunction with the studies, the hole saturated taper and the saturated processing time were taken as the primary criteria for evaluation of the hole quality and the machining efficiency, respectively. Finally, the trepanning patterns were optimized aiming for the high hole quality; the process was based on the saturated hole tapers. The hole high qualities and machining efficiencies were obtained based on the saturated processing time, which was proven to have a great significance when using the nanosecond pulse laser to machine Al<sub>2</sub>O<sub>3</sub> ceramics substrate.https://www.mdpi.com/1996-1944/14/14/3834filled spiral laser trepanningmultiple rings laser trepanningholeAl<sub>2</sub>O<sub>3</sub>nanosecond pulse laser
spellingShingle Wanqin Zhao
Xuesong Mei
Optimization of Trepanning Patterns for Holes Ablated Using Nanosecond Pulse Laser in Al<sub>2</sub>O<sub>3</sub> Ceramics Substrate
Materials
filled spiral laser trepanning
multiple rings laser trepanning
hole
Al<sub>2</sub>O<sub>3</sub>
nanosecond pulse laser
title Optimization of Trepanning Patterns for Holes Ablated Using Nanosecond Pulse Laser in Al<sub>2</sub>O<sub>3</sub> Ceramics Substrate
title_full Optimization of Trepanning Patterns for Holes Ablated Using Nanosecond Pulse Laser in Al<sub>2</sub>O<sub>3</sub> Ceramics Substrate
title_fullStr Optimization of Trepanning Patterns for Holes Ablated Using Nanosecond Pulse Laser in Al<sub>2</sub>O<sub>3</sub> Ceramics Substrate
title_full_unstemmed Optimization of Trepanning Patterns for Holes Ablated Using Nanosecond Pulse Laser in Al<sub>2</sub>O<sub>3</sub> Ceramics Substrate
title_short Optimization of Trepanning Patterns for Holes Ablated Using Nanosecond Pulse Laser in Al<sub>2</sub>O<sub>3</sub> Ceramics Substrate
title_sort optimization of trepanning patterns for holes ablated using nanosecond pulse laser in al sub 2 sub o sub 3 sub ceramics substrate
topic filled spiral laser trepanning
multiple rings laser trepanning
hole
Al<sub>2</sub>O<sub>3</sub>
nanosecond pulse laser
url https://www.mdpi.com/1996-1944/14/14/3834
work_keys_str_mv AT wanqinzhao optimizationoftrepanningpatternsforholesablatedusingnanosecondpulselaserinalsub2subosub3subceramicssubstrate
AT xuesongmei optimizationoftrepanningpatternsforholesablatedusingnanosecondpulselaserinalsub2subosub3subceramicssubstrate