A Design Method to Improve Temperature Uniformity on Wafer for Rapid Thermal Processing
Single-wafer rapid thermal processing (RTP) is widely used in semiconductor manufacturing. Achieving temperature uniformity on silicon wafer is a major challenge in RTP control. In this work, a lamp configuration including five concentric lamp zones is designed to obtain uniform temperature distribu...
| Main Authors: | , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2018-09-01
|
| Series: | Electronics |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2079-9292/7/10/213 |
| Summary: | Single-wafer rapid thermal processing (RTP) is widely used in semiconductor manufacturing. Achieving temperature uniformity on silicon wafer is a major challenge in RTP control. In this work, a lamp configuration including five concentric lamp zones is designed to obtain uniform temperature distribution on the wafer. An optics-based model is developed to determine the optimal lamp design parameters, and a uniformity criterion is proposed to evaluate the effective irradiance distribution of the tungsten–halogen lamps on the wafer. This method can be used to determine geometric parameters of the lamp array in order to achieve uniform temperature distribution on the wafer. A realistic simulation of a cold wall RTP system with five lamp rings and a 200-mm wafer is performed. The proposed model makes way for a simple method for determining the optimal lamp design parameters in RTP systems. |
|---|---|
| ISSN: | 2079-9292 |