A Design Method to Improve Temperature Uniformity on Wafer for Rapid Thermal Processing
Single-wafer rapid thermal processing (RTP) is widely used in semiconductor manufacturing. Achieving temperature uniformity on silicon wafer is a major challenge in RTP control. In this work, a lamp configuration including five concentric lamp zones is designed to obtain uniform temperature distribu...
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| Format: | Article |
| Language: | English |
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MDPI AG
2018-09-01
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| Series: | Electronics |
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| Online Access: | http://www.mdpi.com/2079-9292/7/10/213 |
| _version_ | 1798039354095960064 |
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| author | Peng Huang Hongguan Yang |
| author_facet | Peng Huang Hongguan Yang |
| author_sort | Peng Huang |
| collection | DOAJ |
| description | Single-wafer rapid thermal processing (RTP) is widely used in semiconductor manufacturing. Achieving temperature uniformity on silicon wafer is a major challenge in RTP control. In this work, a lamp configuration including five concentric lamp zones is designed to obtain uniform temperature distribution on the wafer. An optics-based model is developed to determine the optimal lamp design parameters, and a uniformity criterion is proposed to evaluate the effective irradiance distribution of the tungsten–halogen lamps on the wafer. This method can be used to determine geometric parameters of the lamp array in order to achieve uniform temperature distribution on the wafer. A realistic simulation of a cold wall RTP system with five lamp rings and a 200-mm wafer is performed. The proposed model makes way for a simple method for determining the optimal lamp design parameters in RTP systems. |
| first_indexed | 2024-04-11T21:52:43Z |
| format | Article |
| id | doaj.art-fc5bf46d8c5b4d419ddd7c47a9c11464 |
| institution | Directory Open Access Journal |
| issn | 2079-9292 |
| language | English |
| last_indexed | 2024-04-11T21:52:43Z |
| publishDate | 2018-09-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Electronics |
| spelling | doaj.art-fc5bf46d8c5b4d419ddd7c47a9c114642022-12-22T04:01:12ZengMDPI AGElectronics2079-92922018-09-0171021310.3390/electronics7100213electronics7100213A Design Method to Improve Temperature Uniformity on Wafer for Rapid Thermal ProcessingPeng Huang0Hongguan Yang1School of Physics and Electronics, Hunan University, Changsha 410082, ChinaSchool of Physics and Electronics, Hunan University, Changsha 410082, ChinaSingle-wafer rapid thermal processing (RTP) is widely used in semiconductor manufacturing. Achieving temperature uniformity on silicon wafer is a major challenge in RTP control. In this work, a lamp configuration including five concentric lamp zones is designed to obtain uniform temperature distribution on the wafer. An optics-based model is developed to determine the optimal lamp design parameters, and a uniformity criterion is proposed to evaluate the effective irradiance distribution of the tungsten–halogen lamps on the wafer. This method can be used to determine geometric parameters of the lamp array in order to achieve uniform temperature distribution on the wafer. A realistic simulation of a cold wall RTP system with five lamp rings and a 200-mm wafer is performed. The proposed model makes way for a simple method for determining the optimal lamp design parameters in RTP systems.http://www.mdpi.com/2079-9292/7/10/213rapid thermal processingsingle-wafer processtemperature uniformitylamp configuration design |
| spellingShingle | Peng Huang Hongguan Yang A Design Method to Improve Temperature Uniformity on Wafer for Rapid Thermal Processing Electronics rapid thermal processing single-wafer process temperature uniformity lamp configuration design |
| title | A Design Method to Improve Temperature Uniformity on Wafer for Rapid Thermal Processing |
| title_full | A Design Method to Improve Temperature Uniformity on Wafer for Rapid Thermal Processing |
| title_fullStr | A Design Method to Improve Temperature Uniformity on Wafer for Rapid Thermal Processing |
| title_full_unstemmed | A Design Method to Improve Temperature Uniformity on Wafer for Rapid Thermal Processing |
| title_short | A Design Method to Improve Temperature Uniformity on Wafer for Rapid Thermal Processing |
| title_sort | design method to improve temperature uniformity on wafer for rapid thermal processing |
| topic | rapid thermal processing single-wafer process temperature uniformity lamp configuration design |
| url | http://www.mdpi.com/2079-9292/7/10/213 |
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