Interface reactions between copper and 50In-50Pb (wt%) alloy by solid-state aging
This study investigated the interface microstructure that developed between 50In-50Pb (wt%) solder and copper (Cu) base material as a function of solid-state aging. The aging temperatures and times were in the range of 55°C – 170°C and 1 – 350 days, respectively. The analysis examined the intermetal...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-03-01
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| Series: | Journal of Alloys and Metallurgical Systems |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2949917824000130 |