ALUMINUM METALLIZATION SURFACE CLEANING WITH PLASMA TREATMENT
The purpose of work is to select the optimum plasma etching mode for cleaning the aluminum surface from pollution. METHODS AND METHODOLOGY. In this paper, FPGA chip`s pads aluminum metallization was the object of the study. The averaged thickness of aluminum was 1 micron. The contact pads sizes –10...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Voronezh State University
2017-03-01
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| Series: | Конденсированные среды и межфазные границы |
| Subjects: |