A Three-Dimensional Microdisplacement Sensing System Based on MEMS Bulk-Silicon Technology

A Three-Dimensional Microdisplacement Sensing System Based on MEMS Bulk-Silicon Technology

For the dimensional measurement and characterization of microsized and nanosized components, a three-dimensional microdisplacement sensing system was developed using the piezoresistive effect in silicon. The sensor was fabricated using microelectromechanical system bulk-silicon technology, and it wa...

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Bibliographic Details
Main Authors: Junjie Wu, Lihua Lei, Xin Chen, Xiaoyu Cai, Yuan Li, Tao Han
Format: Article
Language:English
Published: MDPI AG 2014-10-01
Series:Sensors
Subjects:
dimensional metrology
piezoresistor
MEMS
microtactile sensor
Online Access:http://www.mdpi.com/1424-8220/14/11/20533

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