A Three-Dimensional Microdisplacement Sensing System Based on MEMS Bulk-Silicon Technology
For the dimensional measurement and characterization of microsized and nanosized components, a three-dimensional microdisplacement sensing system was developed using the piezoresistive effect in silicon. The sensor was fabricated using microelectromechanical system bulk-silicon technology, and it wa...
Main Authors: | Junjie Wu, Lihua Lei, Xin Chen, Xiaoyu Cai, Yuan Li, Tao Han |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2014-10-01
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Series: | Sensors |
Subjects: | |
Online Access: | http://www.mdpi.com/1424-8220/14/11/20533 |
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