Study on mechanical and thermal properties of a modified epoxy resin
The uniaxial tensile test, linear expansion coefficient test of a modified epoxy resin in the ambient temperature range from -35℃ to 120℃, and the impact test at room temperature were carried out to explore its mechanical and thermal characteristics under temperature change environment. The constitu...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
EDP Sciences
2021-10-01
|
| Series: | Xibei Gongye Daxue Xuebao |
| Subjects: | |
| Online Access: | https://www.jnwpu.org/articles/jnwpu/full_html/2021/05/jnwpu2021395p978/jnwpu2021395p978.html |
| _version_ | 1797426898286936064 |
|---|---|
| author | HUANG Junfeng HE Erming CHEN Pengxiang LI Yongzhi |
| author_facet | HUANG Junfeng HE Erming CHEN Pengxiang LI Yongzhi |
| author_sort | HUANG Junfeng |
| collection | DOAJ |
| description | The uniaxial tensile test, linear expansion coefficient test of a modified epoxy resin in the ambient temperature range from -35℃ to 120℃, and the impact test at room temperature were carried out to explore its mechanical and thermal characteristics under temperature change environment. The constitutive model of the material suitable for temperature change environment is deduced, the numerical calculation is carried out in MATLAB, compared with the relative tested curve, and the obtained constitutive model is applied to the modeling calculation in ABAQUS and the results are verified. The results show that the modified epoxy resin has better strength, stiffness, impact toughness and lower coefficient of linear expansion than common epoxy resins such as E-44, E-51 and EPON e863. The material is suitable to be used as the matrix of spaceborne electronic component potting module. The proposed empirical constitutive model can obtain the stress-strain relationship of the material at any temperature in the range of -35℃~120℃ through interpolation, and can be directly used in relevant damage analysis and life prediction of electronic component potting module. The research method and derivation results have engineering reference value. |
| first_indexed | 2024-03-09T08:36:30Z |
| format | Article |
| id | doaj.art-fe7e9fd048394648842d713bbda612fd |
| institution | Directory Open Access Journal |
| issn | 1000-2758 2609-7125 |
| language | zho |
| last_indexed | 2024-03-09T08:36:30Z |
| publishDate | 2021-10-01 |
| publisher | EDP Sciences |
| record_format | Article |
| series | Xibei Gongye Daxue Xuebao |
| spelling | doaj.art-fe7e9fd048394648842d713bbda612fd2023-12-02T18:13:19ZzhoEDP SciencesXibei Gongye Daxue Xuebao1000-27582609-71252021-10-0139597898610.1051/jnwpu/20213950978jnwpu2021395p978Study on mechanical and thermal properties of a modified epoxy resinHUANG Junfeng0HE Erming1CHEN Pengxiang2LI Yongzhi3School of Aeronautics, Northwestern Polytechnical UniversitySchool of Aeronautics, Northwestern Polytechnical UniversitySchool of Aeronautics, Northwestern Polytechnical UniversitySchool of Aeronautics, Northwestern Polytechnical UniversityThe uniaxial tensile test, linear expansion coefficient test of a modified epoxy resin in the ambient temperature range from -35℃ to 120℃, and the impact test at room temperature were carried out to explore its mechanical and thermal characteristics under temperature change environment. The constitutive model of the material suitable for temperature change environment is deduced, the numerical calculation is carried out in MATLAB, compared with the relative tested curve, and the obtained constitutive model is applied to the modeling calculation in ABAQUS and the results are verified. The results show that the modified epoxy resin has better strength, stiffness, impact toughness and lower coefficient of linear expansion than common epoxy resins such as E-44, E-51 and EPON e863. The material is suitable to be used as the matrix of spaceborne electronic component potting module. The proposed empirical constitutive model can obtain the stress-strain relationship of the material at any temperature in the range of -35℃~120℃ through interpolation, and can be directly used in relevant damage analysis and life prediction of electronic component potting module. The research method and derivation results have engineering reference value.https://www.jnwpu.org/articles/jnwpu/full_html/2021/05/jnwpu2021395p978/jnwpu2021395p978.htmlmodified epoxy resinmechanical and thermal characteristicsconstitutive model |
| spellingShingle | HUANG Junfeng HE Erming CHEN Pengxiang LI Yongzhi Study on mechanical and thermal properties of a modified epoxy resin Xibei Gongye Daxue Xuebao modified epoxy resin mechanical and thermal characteristics constitutive model |
| title | Study on mechanical and thermal properties of a modified epoxy resin |
| title_full | Study on mechanical and thermal properties of a modified epoxy resin |
| title_fullStr | Study on mechanical and thermal properties of a modified epoxy resin |
| title_full_unstemmed | Study on mechanical and thermal properties of a modified epoxy resin |
| title_short | Study on mechanical and thermal properties of a modified epoxy resin |
| title_sort | study on mechanical and thermal properties of a modified epoxy resin |
| topic | modified epoxy resin mechanical and thermal characteristics constitutive model |
| url | https://www.jnwpu.org/articles/jnwpu/full_html/2021/05/jnwpu2021395p978/jnwpu2021395p978.html |
| work_keys_str_mv | AT huangjunfeng studyonmechanicalandthermalpropertiesofamodifiedepoxyresin AT heerming studyonmechanicalandthermalpropertiesofamodifiedepoxyresin AT chenpengxiang studyonmechanicalandthermalpropertiesofamodifiedepoxyresin AT liyongzhi studyonmechanicalandthermalpropertiesofamodifiedepoxyresin |