Fabrication of Substrate-Integrated Waveguide Using Micromachining of Photoetchable Glass Substrate for 5G Millimeter-Wave Applications

Fabrication of Substrate-Integrated Waveguide Using Micromachining of Photoetchable Glass Substrate for 5G Millimeter-Wave Applications

A millimeter-wave substrate-integrated waveguide (SIW) was firstly demonstrated using the micromachining of photoetchable glass (PEG) for 5G applications. A PEG substrate was used as a dielectric material of the SIW, and its photoetchable properties were used to fabricate through glass via (TGV) hol...

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Bibliographic Details
Main Authors:	Seung-Han Chung, Jae-Hyun Shin, Yong-Kweon Kim, Chang-Wook Baek
Format:	Article
Language:	English
Published:	MDPI AG 2023-01-01
Series:	Micromachines
Subjects:	millimeter-wave substrate integrated waveguide micromachining photoetchable glass through glass via
Online Access:	https://www.mdpi.com/2072-666X/14/2/288

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