Application of the technology of thin films and nanostructured materials in the manufacture of thermally loaded printed circuit boards
The expediency is shown for application of aluminum nitride thin films, which has unique physical and chemical properties, for high heat resistance of the circuit board. There was described the technology of printed circuit board with resistors, located in the vias, based on the use of a metal base...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Politehperiodika
2011-11-01
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| Series: | Tekhnologiya i Konstruirovanie v Elektronnoi Apparature |
| Subjects: | |
| Online Access: | http://www.tkea.com.ua/tkea/2011/5_2011/pdf/01.zip |
| _version_ | 1818656517768871936 |
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| author | Sakhno E. A. Balashov M. A. Zhilikov V. V. Lobasov D. V. |
| author_facet | Sakhno E. A. Balashov M. A. Zhilikov V. V. Lobasov D. V. |
| author_sort | Sakhno E. A. |
| collection | DOAJ |
| description | The expediency is shown for application of aluminum nitride thin films, which has unique physical and chemical properties, for high heat resistance of the circuit board. There was described the technology of printed circuit board with resistors, located in the vias, based on the use of a metal base coated with aluminum nitride. |
| first_indexed | 2024-12-17T03:26:51Z |
| format | Article |
| id | doaj.art-ff954141f1d84e28a85fe8217a305168 |
| institution | Directory Open Access Journal |
| issn | 2225-5818 |
| language | English |
| last_indexed | 2024-12-17T03:26:51Z |
| publishDate | 2011-11-01 |
| publisher | Politehperiodika |
| record_format | Article |
| series | Tekhnologiya i Konstruirovanie v Elektronnoi Apparature |
| spelling | doaj.art-ff954141f1d84e28a85fe8217a3051682022-12-21T22:05:23ZengPolitehperiodikaTekhnologiya i Konstruirovanie v Elektronnoi Apparature2225-58182011-11-01535Application of the technology of thin films and nanostructured materials in the manufacture of thermally loaded printed circuit boardsSakhno E. A.Balashov M. A.Zhilikov V. V.Lobasov D. V.The expediency is shown for application of aluminum nitride thin films, which has unique physical and chemical properties, for high heat resistance of the circuit board. There was described the technology of printed circuit board with resistors, located in the vias, based on the use of a metal base coated with aluminum nitride.http://www.tkea.com.ua/tkea/2011/5_2011/pdf/01.zipprinted circuit boardmetal basethermal conductivityaluminum nitride |
| spellingShingle | Sakhno E. A. Balashov M. A. Zhilikov V. V. Lobasov D. V. Application of the technology of thin films and nanostructured materials in the manufacture of thermally loaded printed circuit boards Tekhnologiya i Konstruirovanie v Elektronnoi Apparature printed circuit board metal base thermal conductivity aluminum nitride |
| title | Application of the technology of thin films and nanostructured materials in the manufacture of thermally loaded printed circuit boards |
| title_full | Application of the technology of thin films and nanostructured materials in the manufacture of thermally loaded printed circuit boards |
| title_fullStr | Application of the technology of thin films and nanostructured materials in the manufacture of thermally loaded printed circuit boards |
| title_full_unstemmed | Application of the technology of thin films and nanostructured materials in the manufacture of thermally loaded printed circuit boards |
| title_short | Application of the technology of thin films and nanostructured materials in the manufacture of thermally loaded printed circuit boards |
| title_sort | application of the technology of thin films and nanostructured materials in the manufacture of thermally loaded printed circuit boards |
| topic | printed circuit board metal base thermal conductivity aluminum nitride |
| url | http://www.tkea.com.ua/tkea/2011/5_2011/pdf/01.zip |
| work_keys_str_mv | AT sakhnoea applicationofthetechnologyofthinfilmsandnanostructuredmaterialsinthemanufactureofthermallyloadedprintedcircuitboards AT balashovma applicationofthetechnologyofthinfilmsandnanostructuredmaterialsinthemanufactureofthermallyloadedprintedcircuitboards AT zhilikovvv applicationofthetechnologyofthinfilmsandnanostructuredmaterialsinthemanufactureofthermallyloadedprintedcircuitboards AT lobasovdv applicationofthetechnologyofthinfilmsandnanostructuredmaterialsinthemanufactureofthermallyloadedprintedcircuitboards |