Integrated silicon pressure sensors using wafer bonding technology
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1997.
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| Format: | Thesis |
| Language: | eng |
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Massachusetts Institute of Technology
2005
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| Online Access: | http://hdl.handle.net/1721.1/10451 |
| _version_ | 1811076127141134336 |
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| author | Parameswaran, Lalitha |
| author2 | Martin A. Schmidt. |
| author_facet | Martin A. Schmidt. Parameswaran, Lalitha |
| author_sort | Parameswaran, Lalitha |
| collection | MIT |
| description | Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1997. |
| first_indexed | 2024-09-23T10:16:37Z |
| format | Thesis |
| id | mit-1721.1/10451 |
| institution | Massachusetts Institute of Technology |
| language | eng |
| last_indexed | 2024-09-23T10:16:37Z |
| publishDate | 2005 |
| publisher | Massachusetts Institute of Technology |
| record_format | dspace |
| spelling | mit-1721.1/104512019-04-11T00:21:52Z Integrated silicon pressure sensors using wafer bonding technology Parameswaran, Lalitha Martin A. Schmidt. Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science Electrical Engineering and Computer Science Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1997. Includes bibliographical references (p. 151-156). by Lalitha Parameswaran. Ph.D. 2005-08-18T20:46:09Z 2005-08-18T20:46:09Z 1997 1997 Thesis http://hdl.handle.net/1721.1/10451 37650031 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 156 p. 11599576 bytes 11599331 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology |
| spellingShingle | Electrical Engineering and Computer Science Parameswaran, Lalitha Integrated silicon pressure sensors using wafer bonding technology |
| title | Integrated silicon pressure sensors using wafer bonding technology |
| title_full | Integrated silicon pressure sensors using wafer bonding technology |
| title_fullStr | Integrated silicon pressure sensors using wafer bonding technology |
| title_full_unstemmed | Integrated silicon pressure sensors using wafer bonding technology |
| title_short | Integrated silicon pressure sensors using wafer bonding technology |
| title_sort | integrated silicon pressure sensors using wafer bonding technology |
| topic | Electrical Engineering and Computer Science |
| url | http://hdl.handle.net/1721.1/10451 |
| work_keys_str_mv | AT parameswaranlalitha integratedsiliconpressuresensorsusingwaferbondingtechnology |