Conformal single-layer encapsulation of PEDOT at low substrate temperature

In this work, we demonstrate a single-layer encapsulation method for poly(3,4-ethylenedioxythiophene) (PEDOT). This method is achieved by initiated chemical vapor deposition (iCVD) process, which is scalable and employs solvent-free and low-substrate temperature conditions. The encapsulant used, pol...

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Bibliographic Details
Main Authors: Chen, Nan, Wang, Xiaoxue, Gleason, Karen K
Other Authors: Massachusetts Institute of Technology. Department of Chemical Engineering
Format: Article
Language:en_US
Published: Elsevier 2017
Online Access:http://hdl.handle.net/1721.1/106566
https://orcid.org/0000-0002-5520-2473
https://orcid.org/0000-0001-6127-1056
Description
Summary:In this work, we demonstrate a single-layer encapsulation method for poly(3,4-ethylenedioxythiophene) (PEDOT). This method is achieved by initiated chemical vapor deposition (iCVD) process, which is scalable and employs solvent-free and low-substrate temperature conditions. The encapsulant used, poly(divinylbenzene-co-maleic anhydride) (PDVB-MA), was first time synthesized via vapor phase process. This cross-linked iCVD polymer can be rapidly deposited (40 nm min−1) with uniform and conformal morphology. In the test of PEDOT degradation, the encapsulation extended the halflife of PEDOT to 900 h at 30 °C in air, which is more than 10 times of the counterpart without encapsulation.