Conformal single-layer encapsulation of PEDOT at low substrate temperature
In this work, we demonstrate a single-layer encapsulation method for poly(3,4-ethylenedioxythiophene) (PEDOT). This method is achieved by initiated chemical vapor deposition (iCVD) process, which is scalable and employs solvent-free and low-substrate temperature conditions. The encapsulant used, pol...
Main Authors: | , , |
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Other Authors: | |
Format: | Article |
Language: | en_US |
Published: |
Elsevier
2017
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Online Access: | http://hdl.handle.net/1721.1/106566 https://orcid.org/0000-0002-5520-2473 https://orcid.org/0000-0001-6127-1056 |
Summary: | In this work, we demonstrate a single-layer encapsulation method for poly(3,4-ethylenedioxythiophene) (PEDOT). This method is achieved by initiated chemical vapor deposition (iCVD) process, which is scalable and employs solvent-free and low-substrate temperature conditions. The encapsulant used, poly(divinylbenzene-co-maleic anhydride) (PDVB-MA), was first time synthesized via vapor phase process. This cross-linked iCVD polymer can be rapidly deposited (40 nm min−1) with uniform and conformal morphology. In the test of PEDOT degradation, the encapsulation extended the halflife of PEDOT to 900 h at 30 °C in air, which is more than 10 times of the counterpart without encapsulation. |
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